The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape.

The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.

Aspects of the present disclosure provide fluoropolymers and methods for forming and using such fluoropolymers. Fluoropolymers include polyfluorobenzoxazines and polyfluoroimides. Methods for forming polyphthalonitriles are also provided. The present disclosure is further directed to compositions containing one or more fluoropolymers and one or more metal oxides.

A polyimide composition, comprising a functionalized polyimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride; a substituted or unsubstituted C.sub.1-40 organic diamine; and optionally an organic compound comprising at least two functional groups per molecule, wherein a first functional group is reactive with an anhydride group, an amine group, or a combination thereof, and the first functional group is different from a second functional group, wherein the functionalized polyimide comprises a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, or a combination thereof, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyimide has a total reactive end group concentration of 50-1,500 μeq/g of the functionalized polyimide, and wherein the polyimide composition has 0.05-1,000 ppm of residual organic diamine, wherein the functionalized polyimide is obtained by precipitation from a solution using an organic anti-solvent or by devolatilization.

The resin composition according to one aspect is a resin composition containing a polyamic acid and a solvent, wherein the polyamic acid has a repeating unit represented by the following general formula (1) in a molecular chain, and the molecular chain has a structure represented by the following general formula (2) at one end or both ends. The proportion of the structure represented by the following general formula (2) relative to 1 mol of the repeating unit represented by the following general formula (1) is 0.001 mol or more and 0.1 mol or less. In the following general formulas, R.sup.1 is a tetravalent organic group; R.sup.2 is a divalent organic group; and R.sup.3 is an organic group having 15 or less carbon atoms.

##STR00001##

A polyimide copolymer according to an embodiment of the present disclosure includes a plurality of structural units. The plurality of structural units include a structural unit derived from dianhydride having an alicyclic structure and a structural unit derived from aromatic diamine including an ether group, thereby mechanical properties, thermal stability and optical characteristics of the polyimide film may be improved.

A solar cell including a semiconductor substrate having a first conductivity type an emitter region, having a second conductivity type opposite to the first conductivity type, on a first main surface of the semiconductor substrate an emitter electrode which is in contact with the emitter region a base region having the first conductivity type a base electrode which is in contact with the base region and an insulator film for preventing an electrical short-circuit between the emitter region and the base region, wherein the insulator film is made of a polyimide, and the insulator film has a C.sub.6H.sub.11O.sub.2 detection count number of 100 or less when the insulator film is irradiated with Bi.sub.5.sup.++ ions with an acceleration voltage of 30 kV and an ion current of 0.2 pA by a TOF-SIMS method. The solar cell can have excellent weather resistance and high photoelectric conversion characteristics.

A polyimide luminescent material, a preparation method, and a used thereof are disclosed; the polyimide luminescent material includes a polyimide resin and a rare earth complex distributed in the polyimide resin, wherein the polyimide resin is a condensation polymer of an aromatic diamine containing a bidentate chelate ligand and an aromatic dianhydride, and the rare earth complex and the bidentate chelate ligand are connected by a chemical bond. The luminescent material has enhanced fluorescence intensity, thermal stability, and mechanical properties. The preparation method is simple and easy, and is suitable for industrial production.

A transparent polyimide film, prepared from a copolymerized polyamide acid according to a chemical cyclization method, is provided. The copolymerized polyamide acid requires at least a semi-aromatic polyamide acid, and the semi-aromatic polyamide acid is formed by reacting cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) and 2,2′-bis(trifluoromethyl)diaminodiphenyl (TFMB). The molar number of dianhydrides of the semi-aromatic polyamide acid is more than 20% of the total molar number of anhydrides of the copolymerized polyamide acid, so that the transparent polyimide film has a light transmittance greater than 80%, a chroma b* less than 5, and a CTE less than 35 ppm/° C.

Provided a diamine compound, a polyimide precursor and a polyimide film using the same, and a use thereof. The diamine compound may be very useful as a monomer for manufacturing a polyimide film having excellent transparency, high heat resistance, and low retardation.