The present invention relates to a thermoplastic molding compound comprising a polyalkylene terephthalate and a polyimide, wherein the molding compound has a single glass transition temperature in DSC measurement. The present invention further relates to the use thereof and to fibers, films and shaped bodies produced from the molding compound.

A polyamideimide resin having an isocyanate group blocked with a compound selected from the group consisting of alcohols, oximes and lactams, and having a carboxyl group blocked with a vinyl ether group-containing compound.

Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

Disclosed are a polyamideimide resin composition comprising (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, and (C) water; and a fluorine-based coating material comprising the polyamideimide resin composition and a fluororesin.

Porous three-dimensional networks of polyimide and porous three-dimensional networks of carbon and methods of their manufacture are described. For example, polyimide aerogels are prepared by mixing a dianhydride and a diisocyanate in a solvent comprising a pyrrolidone and acetonitrile at room temperature to form a sol-gel material and supercritically drying the sol-gel material to form the polyimide aerogel. Porous three-dimensional polyimide networks, such as polyimide aerogels, may also exhibit a fibrous morphology. Having a porous three-dimensional polyimide network undergo an additional step of pyrolysis may result in the three dimensional network being converted to a purely carbon skeleton, yielding a porous three-dimensional carbon network. The carbon network, having been derived from a fibrous polyimide network, may also exhibit a fibrous morphology.

A polyamideimide and polyamide amic acid resin polymer that allows for reduced levels of toxicity in manufacturing. In an embodiment, a coating composition comprises at least one polyamideimide resin, at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from a group consisting of methyl acetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ε-caprolactone and methylcyclohexane.

Techniques and mechanisms to reduce toxicity in manufacturing of a polyamideimide and polyamide amic acid resin polymer. In an embodiment, a polyamideimide is produced using at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from the group consisting of methyl actetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ε-caprolactone and methylcyclohexane.

An electrically-insulating resin composition comprising a polyamide-imide resin, a silica fine particle and a dispersant having a phosphate ester group. This electrically-insulating resin composition can be used to provide an electrical insulator having excellent withstand voltage life characteristics against a surge voltage.

A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D.sub.(S-P) represented by a formula (1) satisfying a relationship of D.sub.(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×10.sup.4 to 30×10.sup.4 or a number-average molecular weight of the polyamide-imide is 2×10.sup.4 to 5×10.sup.4.
D.sub.(S-P)=[(dD.sup.S−dD.sup.P).sup.2+(dP.sup.S−dP.sup.P).sup.2+(dH.sup.S−dH.sup.P).sup.2].sup.1/2  (1)