A polyetherimide composition comprises: a polyetherimide; and an organophosphorus stabilizer present in an amount effective to provide greater than 0.01 ppm to less than 20 ppm, preferably greater than 0.01 ppm to less than 10 ppm, and more preferably greater than 0.01 ppm to less than 4.8 ppm of phosphorus based on the total weight of the polyetherimide composition, the organophosphorus stabilizer having a molecular weight of 300 to 2,000 Daltons and a phosphorus content of 1 to 15 wt %; wherein a molded sample of the polyetherimide composition has a UL 94 V0 rating at a thickness of 1.5 mm.

Embodiments of the present invention include composite compositions extrusion compounded together comprising a polymer, an amount of nanotubes, and an amount of finely milled carbon fiber having an aspect ratio greater than 1 and less than about 5. The resulting composite materials allow for high carbon loading levels with improved tribological properties including coefficient of friction and wear rates, provides uniform surface resistance with minimal processing sensitivity, retains rheological properties similar to the base resin, and provides isotropic shrink and a reduced coefficient of thermal expansion leading to minimal warp. In general, various articles can be formed that take advantage of the properties of the composite materials incorporating a polymer, carbon nanotubes and finely milled carbon fiber.

Amine-substituted copolymers that may include an amine-substituted 2-amino-ethan-1-ol moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diamine. Articles, such as wires, having a surface on which a polyimide is disposed. Methods for forming polymers.

A method of making polyetherimide comprising reacting a first diamine having four bonds between the amine groups, a second diamine having greater than or equal to five bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic in the presence of a solvent and a polymer additive to produce a mixture comprising 3,3′-bis(halophthalimide)s, 3,4′-bis(halophthalimide)s, 4,4′-bis(halophthalimide)s, solvent and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 98:02 to 50:50 and the molar ratio of the first diamine to the second diamine is 98:02 to 02:98; and reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 5 weight percent, based on the total weight of the polyetherimide, wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure.

A polymer composition of cross-linked fluoropolymers is provided, that is generated using a fluoropolymer compatibilizer. The cross-linked fluoropolymers have excellent mechanical and dielectric characteristics at high temperatures, making them useful for such applications as insulation for automotive communications cables and PCB laminates.

One embodiment relates to a composition for forming a polyimide film for a cover window, a method for preparing the same, and uses thereof. According to one embodiment, it is possible to provide a polyimide film for a cover window that has excellent isotropy and scattering resistance, and at the same time is flexible and has excellent bending physical properties, without lowering colorless and transparent optical physical properties. In addition, the polyimide film for a cover window according to an embodiment may be usefully used in various flexible display devices.

The present invention provides a polyimide film, which comprises a polyimide having a structure represented by formula (I):

##STR00001## in which A is a residue group of an aromatic diamine containing a sulfonyl group in its main chain moiety, R.sub.1 is a residue group of an aromatic dianhydride, R.sub.2 is a residue group of an aliphatic dianhydride, m and n are each independently a positive integer, a diamine monomer constituting the polyimide is only composed of the aromatic diamine containing the sulfonyl group in its main chain moiety, and the polyimide is surface-dried at 75° C. to 155° C. in the process of forming the polyimide film. The polyimide film of the present invention has transparency and UV absorption properties.

A polyetherimide of improved color and processes for preparing the polyetherimide are disclosed.

The present invention provides a random or block polyimide-siloxane copolymer, which may be prepared from a hard amine monomer, a dianhydride monomer, and a soft amine monomer, may have mechanical properties, flexibility, and thermal properties adjusted through the control of soft amine content, and may exhibits high thermal stability, corrosion resistance, transparency and flexibility, and a method for preparing the same. The random or block polyimide-siloxane copolymer, which may be flexible and thermally stable and may exhibits adjustable mechanical properties and skin-like sensory functions, may be applied to flexible electronic devices.

A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.