Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.

The present disclosure is directed to providing a support substrate for a display device capable of obtaining high transparency while accomplishing thinning and flexibility of an organic EL display device.

In view of the above, the present disclosure provides a support substrate for a display device including a TFT glass substrate having a thickness of 10 μm to 150 μm, and a polyimide resin layer having a thickness of 150 nm or less installed in contact with the TFT glass substrate.

A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.

A polyimide composition, comprising a functionalized polyimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride; a substituted or unsubstituted C.sub.1-40 organic diamine; and optionally an organic compound comprising at least two functional groups per molecule, wherein a first functional group is reactive with an anhydride group, an amine group, or a combination thereof, and the first functional group is different from a second functional group, wherein the functionalized polyimide comprises a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, or a combination thereof, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyimide has a total reactive end group concentration of 50-1,500 μeq/g of the functionalized polyimide, and wherein the polyimide composition has 0.05-1,000 ppm of residual organic diamine, wherein the functionalized polyimide is obtained by precipitation from a solution using an organic anti-solvent or by devolatilization.

A polyimide luminescent material, a preparation method, and a used thereof are disclosed; the polyimide luminescent material includes a polyimide resin and a rare earth complex distributed in the polyimide resin, wherein the polyimide resin is a condensation polymer of an aromatic diamine containing a bidentate chelate ligand and an aromatic dianhydride, and the rare earth complex and the bidentate chelate ligand are connected by a chemical bond. The luminescent material has enhanced fluorescence intensity, thermal stability, and mechanical properties. The preparation method is simple and easy, and is suitable for industrial production.

The purpose of the present invention is to provide: a polyimide film which is able to be formed at relatively low temperatures, while being less susceptible to coloring and having high transparency; and a polyamide acid or varnish for achieving this polyimide film. This polyimide film contains a polyimide which is a polymerization product of a tetracarboxylic acid dianhydride component and a diamine component. The tetracarboxylic acid dianhydride component contains from 60% by mole to 100% by mole of a tetracarboxylic acid dianhydride of a specific structure relative to the total amount of the tetracarboxylic acid dianhydride; and the diamine component contains from 30% by mole to 70% by mole of an alicyclic diamine and from 30% by mole to 70% by mole of an alkylene diamine relative to the total amount of the diamine component.

A polyetherimide of improved color and processes for preparing the polyetherimide are disclosed.

The present invention provides a polyimide composite having material properties suitable for preparing a polyimide film having high transmittance, high stability, and a good mechanical property, so that it can be used as a substrate material of an organic light-emitting diode (OLED), an encapsulating film material, and so on, but are not limited thereto. The polyimide composite has a molecular structural formula as follow:

##STR00001##

A polyimide oligomer of formula (1a), (1b), a copolymer thereof, or a combination thereof ##STR00001##
wherein each G.sup.1 is independently the same or different, and is a cation group; each G.sup.2 is independently the same or different, and is an anion group; each D is independently the same or different, and is a single bond or C.sub.1-20 divalent hydrocarbon group; each V is independently the same or different, and is a tetravalent C.sub.4-40 hydrocarbon group; each R is independently the same or different, and is a C.sub.1-20 divalent hydrocarbon group; each n is independently the same or different, and is 1 to 1000, provided that the total of all values of n is greater than 4; and t is 2 to 1000.

An amide compound and a nitrogen-containing heterocyclic ring-containing compound which have a specific repeating unit and a crosslinking site represented by Formula (2):

—C≡CX.sup.1

at a molecular end.