This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.

This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

Provided are a resin composition in which there is a particularly good achievement of low specific gravity, high rigidity, and a low coefficient of linear expansion, a resin composition in which low specific gravity, high rigidity, a low coefficient of thermal expansion, and low water absorbency are all achieved, are a resin composition which has low specific gravity and in which there is a good achievement of the contradictory properties of high toughness and low thermal expansion. Provided in an embodiment is a resin composition containing a first polymer forming a continuous phase, a second polymer forming a dispersed phase, and cellulose, wherein the first polymer is a polyamide and the second polymer is at least one polymer selected from the group consisting of crystalline resins having a melting point of at least 60° C. and non-crystalline resins having a glass transition temperature of at least 60° C.

Provided are a resin composition in which there is a particularly good achievement of low specific gravity, high rigidity, and a low coefficient of linear expansion, a resin composition in which low specific gravity, high rigidity, a low coefficient of thermal expansion, and low water absorbency are all achieved, are a resin composition which has low specific gravity and in which there is a good achievement of the contradictory properties of high toughness and low thermal expansion. Provided in an embodiment is a resin composition containing a first polymer forming a continuous phase, a second polymer forming a dispersed phase, and cellulose, wherein the first polymer is a polyamide and the second polymer is at least one polymer selected from the group consisting of crystalline resins having a melting point of at least 60° C. and non-crystalline resins having a glass transition temperature of at least 60° C.

A styrene resin composition includes: a resin (A) comprising a styrene resin (A1) having a syndiotactic structure and an aliphatic polyamide (A2); and 0.05 to 0.75% by mass of a metal salt (B) of a higher fatty acid. The mass ratio [(A1)/(A2)] between the styrene resin (A1) and the aliphatic polyamide (A2) in the resin (A) is 25/75 to 55/45.

A styrene resin composition includes: a resin (A) comprising a styrene resin (A1) having a syndiotactic structure and an aliphatic polyamide (A2); and 0.05 to 0.75% by mass of a metal salt (B) of a higher fatty acid. The mass ratio [(A1)/(A2)] between the styrene resin (A1) and the aliphatic polyamide (A2) in the resin (A) is 25/75 to 55/45.

An object of the present invention is to provide a polyphenylene ether melt extrusion formed body which can be obtained by melt forming without mixing other resin components and has excellent properties such as mechanical strength, and a method for producing the same. The present invention relates to a polyphenylene ether melt extrusion formed body comprising a polyphenylene ether component which has a rearrangement structure having a continuous structure bonded at an ortho-position in a repeating unit continuously bonded at a para-position.

An object of the present invention is to provide a polyphenylene ether melt extrusion formed body which can be obtained by melt forming without mixing other resin components and has excellent properties such as mechanical strength, and a method for producing the same. The present invention relates to a polyphenylene ether melt extrusion formed body comprising a polyphenylene ether component which has a rearrangement structure having a continuous structure bonded at an ortho-position in a repeating unit continuously bonded at a para-position.