A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4).

A nonflammable solvent composition, a method of cleaning an article, and a method of depositing a material on a substrate are disclosed. The nonflammable solvent composition includes a fluorocyclopentane in which 3 to 9 hydrogen atoms have each been replaced by a fluorine atom; trans-1,2-dichloroethylene (t-DCE); and at least one organic compound, such as a C.sub.2-C.sub.6 alcohol, a C.sub.1-C.sub.6 alkane, and a C.sub.3-C.sub.6 cycloalkane. Amounts of the fluorocyclopentane, t-DCE, and the organic compound in the nonflammable composition are selected so that the composition is an azeotrope or is azeotrope-like. The method of cleaning an article includes contacting the article with the nonflammable composition via vapor degreasing or wet cleaning. The method of depositing a material on a substrate includes dissolving the material in the nonflammable solvent composition, applying the composition containing the material to the substrate, and evaporating the composition from the substrate.

The present application provides binary azeotrope or azeotrope-like compositions comprising perfluoroheptene and an additional component, wherein the additional component is present in the composition in an amount effective to form an azeotrope composition or azeotrope-like composition with the perfluoroheptene. Methods of using the compositions provided herein in cleaning and carrier fluid applications are also provided.

A cleaning liquid for excessive powder removal is provided. The cleaning liquid includes a hydrocarbon solvent having an octanol/water partition coefficient (log P.sub.ow value) of 4.5 or more. The cleaning liquid is to remove excessive powder for molding adhering to a solidified object molded using the powder for molding.

Use as a decalcifying and descaling remover of a composition comprising: a) a first solvent selected from: optionally associated with a second solvent b) selected from at least a lower alcohol, water or mixtures thereof, wherein a1) a eutectic solvent consisting of a hydrogen bond acceptor and of a hydrogen bond donor, a2) an ionic liquid or a3) a mixture of said eutectic solvent and said ionic liquid; in the first eutectic solvent a1) the hydrogen bond acceptor and the hydrogen bond donor are halogen-free.

The present application provides quaternary azeotrope or azeotrope-like compositions comprising trans-dichloroethylene and three or more additional components. Methods of using the compositions provided herein in cleaning, defluxing, deposition, and carrier fluid applications are also provided.

Methods for cleaning a substrate are disclosed. The substrate comprises a dielectric surface and a metal surface. The methods comprise providing a cleaning agent to the reaction chamber.

Disclosed is a substrate treating method of performing drying treatment on a pattern-formed surface of a substrate, the substrate treating method comprising: a supplying step of supplying a substrate treating liquid containing a plastic crystalline material in a molten state to the pattern-formed surface of the substrate; a plastic crystalline layer forming step of bringing, on the pattern-formed surface, the plastic crystalline material into a state of a plastic crystal so as to form a plastic crystalline layer; and a removing step of changing the plastic crystalline material in the state of the plastic crystal into a gas state without an intermediate phase of liquid so as to remove the plastic crystalline material from the pattern-formed surface.

The present application provides binary azeotrope or azeotrope-like compositions comprising perfluoroheptene and an additional component, wherein the additional component is present in the composition in an amount effective to form an azeotrope composition or azeotrope-like composition with the perfluoroheptene. Methods of using the compositions provided herein in cleaning and carrier fluid applications are also provided.

The compositions include a methylated siloxane liquid and a solvent comprising at least one of a ketone or ester each having up to six carbon atoms, a halogenated alkane having up to two carbon atoms, tetrachloroethene, 1-chloro-4-trifluoromethyl benzene, or ethane. The compositions can also include hydrocarbon solvent comprising at least one of toluene, xylene, or a saturated hydrocarbon represented by formula C.sub.xH.sub.2x+y, wherein x is from 5 to 8, and wherein y is 0 or 2 and/or propellant. The method can include applying the composition to a brake system component to clean the brake system component. The method can also include applying a composition including hexamethyldisiloxane to a brake system component to clean the brake system component.