Patent classifications
C23C14/505
IRRADIATION-RESISTANT AND ANTI-WEAR HYDROGEN-FREE CARBON FILM ON POLYMER SURFACE AND PREPARATION METHOD AND USE THEREOF
A hydrogen-free carbon film polymer lubricating material and a preparation method and use thereof are disclosed. In the method, a graphite target is used as the target material, and a magnetron sputtering deposition is performed on a surface of the polymer substrate, thereby physically depositing and forming a hydrogen-free carbon film on the surface of the polymer substrate, thereby obtaining a hydrogen-free carbon film polymer lubricating material.
Coating on mold for glass molding and a preparation method and applications thereof
Disclosed is a coating made of an organic material on a mold for glass molding. The coating comprises Cr.sub.xW.sub.yN.sub.(1-x-y), where 0.15<x<0.4, and 0.2≤y≤0.45. The coating has excellent high temperature resistance and anti-adhesion properties, thus being a promising coating material for molds.
Holding Device for Holding a Magnetizable Substrate during Processing of a Substrate Surface of the Substrate
The invention relates to a holding device (2) for holding a magnetizable substrate (8) during machining of at least one substrate surface, in particular of a magnetizable tool to be machined, comprising a magnetic holding unit (4) arranged at the end for fixing the substrate (8) at the end by forming a magnetic field, a receiving unit (6) arranged on the holding unit (4) for receiving the substrate (8), a replaceable adapter unit (10) arranged within the receiving unit (6) for guiding and shielding the substrate (8), the adapter unit (10) having at least one recess (12) for the feedthrough of the substrate (8), the substrate (8) being fixable within the holding device (2) in a laterally supported manner by means of the recess (12).
Apparatus and method for introducing an optical lens into a turning device
An apparatus and a method for introducing an optical lens into a turning device are disclosed. The apparatus includes a carrier body and a carrier element for receiving the lens. The carrier element is arranged in the carrier body. The carrier element has a supporting surface for receiving the lens and is displaceably mounted in relation to the carrier body.
System and method to control PVD deposition uniformity
A physical vapor deposition chamber comprising a tilting substrate support is described. Methods of processing a substrate are also provided comprising tilting at least one of the substrate and the target to improve the uniformity of the layer on the substrate from the center of the substrate to the edge of the substrate. Process controllers are also described which comprise one or more process configurations causing the physical deposition chamber to perform the operations of rotating a substrate support within the physical deposition chamber and tilting the substrate support at a plurality of angles with respect to a horizontal axis.
Magnetron sputtering source and coating system arrangement
Magnetron sputtering source (1) for coating of a substrate (2), the sputtering source (1) comprising: a target (5) having a target surface at a front side a magnetron arrangement (511, 512) at a backside of the target (5) for creating a magnetic field near the target surface, to define a loop shaped erosion zone (20) at the target surface between an inner magnet assembly (512) and an outer magnet assembly (511), wherein the erosion zone (20) comprises a middle section with two parallel tracks (26) having a distance (d) and two curved end loop sections (27) each of which connects adjoining ends of the parallel tracks (26) and has a loop width (w) in the direction of the distance (d) which is greater than the distance (d) resulting in a double-T-shaped primary geometry of the erosion zone to provide an increased coating material flux from the end loop sections (27) to the substrate.
Tool fixture for multiple process steps
The present invention discloses a tool holding device for shank type tools, comprising at least one tool holder, a base part and a top part, whereby at least the top part comprises uptake holes for the at least one tool holder characterized in that, the tool holding device can be used for more than one process step among transfer, cleaning, pretreatment, coating, posttreatment, and each of the at least one tool holders can optionally take up a sleeve holding the shank type tool in a distinct, preferably upright position and comprises one or more openings, which allow fluid and/or solid treatment agents to exit the tool holder and/or sleeve and the at least one tool holder and/or sleeve enables three-fold rotation of the shank type tool. Further a method using the inventive tool holding device is disclosed.
METHOD OF SPUTTER-COATING SUBSTRATES OR OF MANUFACTURING SPUTTER COATED SUBSTRATES AND APPARATUS
Whenever substrates are rotationally and continuously conveyed in a vacuum recipient around a common axis and past a magnetron sputter source, sputtering of the target, rotating around a central target axis, by the stationary magnetron plasma is adapted to the azimuthal extents radially differently spaced areas of the substrates become exposed to the target thereby improving homogeneity of deposited layer thickness on the substrates and ensuring that the complete sputter surface of the target is net-sputtered.
SYSTEMS AND METHODS FOR FILM DEPOSITION
A system is described herein for film deposition includes a drum; a motor configured to rotate the drum in a direction of rotation; a target including a target material; and a holder attached to the drum. The holder is configured to accommodate a substrate and to expose the substrate to free particles of the target material sputtered from the target, and the holder has an asymmetric shape.
FILM FORMING APPARATUS, CONTROL APPARATUS FOR FILM FORMING APPARTUS, AND FILM FORMING METHOD
A film forming apparatus has a process chamber and a processing unit provided in the process chamber and forming adhesive film. The surface of the inner walls of the process chamber is formed of a material having a large getter effect on gas or water (H.sub.2O) remaining in the process chamber.