A novel minimum boiling binary azeotrope of n-undecane and n-butyl-3-hydroxybutyrate is shown to have utility as a solvent for degreasing of both nonpolar and polar contaminants. The components of the azeotrope are stable against degradation and the composition is largely invariant with pressure, yielding a unique solvent that can be used in cold cleaning and in vapor degreasing at elevated temperatures and over a wide range of pressures.

A novel minimum boiling binary azeotrope of n-undecane and n-butyl-3-hydroxybutyrate is shown to have utility as a solvent for degreasing of both nonpolar and polar contaminants. The components of the azeotrope are stable against degradation and the composition is largely invariant with pressure, yielding a unique solvent that can be used in cold cleaning and in vapor degreasing at elevated temperatures and over a wide range of pressures.

Provided in the present disclosure is a liquid metal substrate cleaning method and cleaning and coating integrated device, belonging to the technical field of thermal interface materials construction. The above-mentioned method includes a substrate cleaning and a cleaning qualification inspection, wherein the substrate cleaning comprises a plasma cleaning, an inorganic cleaning reagent cleaning, and an organic reagent cleaning, and any combination of the plasma cleaning, the inorganic cleaning reagent cleaning and the organic reagent cleaning; and the cleaning qualification inspection is judged as qualified or not based on a diffusion area of the organic reagent on a surface of the liquid metal substrate, and when the diffusion area meets a predetermined requirement, the cleaning is finished; and when the diffusion area does not meet the predetermined requirement, the substrate cleaning step is repeated, and the steps are repeated in this way until the diffusion area meets the predetermined requirement.

Provided in the present disclosure is a liquid metal substrate cleaning method and cleaning and coating integrated device, belonging to the technical field of thermal interface materials construction. The above-mentioned method includes a substrate cleaning and a cleaning qualification inspection, wherein the substrate cleaning comprises a plasma cleaning, an inorganic cleaning reagent cleaning, and an organic reagent cleaning, and any combination of the plasma cleaning, the inorganic cleaning reagent cleaning and the organic reagent cleaning; and the cleaning qualification inspection is judged as qualified or not based on a diffusion area of the organic reagent on a surface of the liquid metal substrate, and when the diffusion area meets a predetermined requirement, the cleaning is finished; and when the diffusion area does not meet the predetermined requirement, the substrate cleaning step is repeated, and the steps are repeated in this way until the diffusion area meets the predetermined requirement.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.