A vacuum pressure furnace and/or a cooling plate for a vacuum pressure furnace is described, having a cooling channel or tube that selectively circulates a liquid coolant at a reduced temperature. The cooling channel “snakes” back and forth through a target plate assembly to conduct heat from the target plate assembly and back to the coolant. The target plate assembly includes a plurality of clamp members that are screwed over portions of the cooling channel and to a bottom of a plate member of the assembly, enclosing portions of the cooling channel. Thermal sheets or foil are wrapped around the cooling channel, thereby bridging any gaps between the components that may occur during temperature changes due to thermal expansion/contraction.

A heat treatment furnace disclosed herein may include: a heat treatment unit configured to heat-treat an object; a cooling unit configured to cool the object heat-treated by the heat treatment unit; and a conveyor configured to convey the object in the heat treatment unit and the cooling unit. The cooling unit may include a housing, wherein the housing is disposed below a conveyance path on which the object is conveyed by the conveyor and configured to cool the object being conveyed by the conveyor by liquid flowing inside the housing. The housing may include an upper plate facing the object being conveyed by the conveyor. The upper plate may be tilted so that gas stays at a predetermined portion of the housing while the liquid is flowing in the housing.

The present application provides a baking equipment applied in a display panel manufacturing process. In the present application, the first and second pipes are communicated with each other and evenly distributed inside the baking plate, so that the heating liquid injected from the head end of the first pipe heats the baking plate evenly during flowing through the first and second pipes, which improves the uniformity of the baking temperature of the TFT array substrate to be baked by the baking plate, thereby ensuring the stability of the baking process of the TFT array substrate.

The present application provides a baking equipment applied in a display panel manufacturing process. In the present application, the first and second pipes are communicated with each other and evenly distributed inside the baking plate, so that the heating liquid injected from the head end of the first pipe heats the baking plate evenly during flowing through the first and second pipes, which improves the uniformity of the baking temperature of the TFT array substrate to be baked by the baking plate, thereby ensuring the stability of the baking process of the TFT array substrate.

A process for reducing film boiling by keeping the quenchant pressure above the vapor pressure of the liquid quenchant, and/or using a controlled quenchant renewal to more uniformly cool the surface of part at the initial moment of contact and apparatuses to conduct the pressure and controlled quenchant renewal are disclosed. It is believed that these processes will improve the heat treating of parts with intricate geometries to provide predictable part distortion. The applicability of the method to gun barrels, tubes, round rings, and hollow axles is explained.

A process for reducing film boiling by keeping the quenchant pressure above the vapor pressure of the liquid quenchant, and/or using a controlled quenchant renewal to more uniformly cool the surface of part at the initial moment of contact and apparatuses to conduct the pressure and controlled quenchant renewal are disclosed. It is believed that these processes will improve the heat treating of parts with intricate geometries to provide predictable part distortion. The applicability of the method to gun barrels, tubes, round rings, and hollow axles is explained.

An apparatus for cooling a material includes: at least one reactor, substantially tubular, which is rotatable and which includes a rotating tubular structure defining inside it a chamber for receiving and passing through the material to be cooled; and means for indirectly cooling the material passing through said chamber by means of a cooling fluid, the means for indirect cooling comprise at least one dispensing device for the cooling fluid. The at least one dispensing device includes at least two dispensing mouths defined by respective slots, with substantially longitudinal development, for the escape of the refrigerant fluid, the device being arranged with respect to the tubular structure in so that the flow outgoing from said two slits affects and laps two respective areas, distinct from each other, of the external surface of the tubular structure.

A heat treatment furnace disclosed herein may include: a heat treatment unit configured to heat-treat an object; a cooling unit configured to cool the object heat-treated by the heat treatment unit; and a conveyor configured to convey the object in the heat treatment unit and the cooling unit. The cooling unit may include a housing, wherein the housing is disposed below a conveyance path on which the object is conveyed by the conveyor and configured to cool the object being conveyed by the conveyor by liquid flowing inside the housing. The housing may include an upper plate facing the object being conveyed by the conveyor. The upper plate may be tilted so that gas stays at a predetermined portion of the housing while the liquid is flowing in the housing.