A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.

A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate. The wafer-level assembly method includes: fixedly mounting the plurality of independently manufactured micro hemispherical resonators on the same wafer fixture to implement a wafer-level installation operation.

A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate. The wafer-level assembly method includes: fixedly mounting the plurality of independently manufactured micro hemispherical resonators on the same wafer fixture to implement a wafer-level installation operation.

Gyroscopes are sensors that measure angular rate and angular orientation. A three-dimensional fused silica micro shell rate-integrating gyroscope is presented. One aspect of the gyroscope includes the use of optical sensors to detect motion of the resonator. The proposed gyroscope is attractive because it achieves several magnitudes higher accuracy as well as high vibration and shock insensitivity from a novel resonator design as well as other unique manufacturing processes.

One example includes an instrument system. The system includes instrument components at least partially disposed in an evacuated chamber within an instrument housing. The system also includes a barrier that is configured to seal the evacuated chamber. The barrier includes a plurality of instrument electrodes that are electrically coupled to the instrument components and extending through the barrier. The system further includes a diffusion block formed of a non-diffusive material and coupled to the instrument housing to seal an evacuated cavity within the instrument housing between the barrier and the diffusion block.

Disclosed are devices, materials, systems, and methods, including a device that includes one or more structural components, at least one of the one or more structural components comprising substantially HfO.sub.2—TiO.sub.2 material. Also disclosed is a hemispherical resonator that includes a hemisphere including one or more structural components with at least one of the one or more structural components comprising substantially HfO.sub.2—TiO.sub.2 material, a forcer electrode configured to apply an electrical force on the hemisphere to cause the hemisphere to oscillate, and one or more sensor electrodes disposed in proximity to the hemisphere and configured to sense an orientation of a vibration pattern of the hemispherical resonator gyroscope.

Disclosed are devices, materials, systems, and methods, including a device that includes one or more structural components, at least one of the one or more structural components comprising substantially HfO.sub.2—TiO.sub.2 material. Also disclosed is a hemispherical resonator that includes a hemisphere including one or more structural components with at least one of the one or more structural components comprising substantially HfO.sub.2—TiO.sub.2 material, a forcer electrode configured to apply an electrical force on the hemisphere to cause the hemisphere to oscillate, and one or more sensor electrodes disposed in proximity to the hemisphere and configured to sense an orientation of a vibration pattern of the hemispherical resonator gyroscope.

The present invention is related to a triaxial micro-electromechanical gyroscope, comprising: a ring-shaped detection capacitor located at the center; two sets of driving capacitors located at outer sides of the ring-shaped detection capacitor and symmetrically distributed at two sides of an origin along a y-axis; two sets of second detection capacitors located at the outer sides of the ring-shaped detection capacitor respectively and symmetrically distributed at the two sides of the origin along an x-axis; and a linkage part connected with movable polar plates of the driving capacitors, movable polar plates of the second detection capacitors, and an outer edge of ring-shaped upper polar plates of the ring-shaped detection capacitor, respectively. The triaxial micro-electromechanical gyroscope provided by the present invention adopts a single structure design, and integrates capacitive electrostatic driving and differential capacitive detection.

A support structure for a micro-vibrator includes: a micro-vibrating body having a curved surface portion and a recess recessed from the curved surface portion; and a support member having a rod and an adhesive member arranged at a tip end of the rod. The support member is adhered on a connecting surface of the recess through the adhesive member. The connecting surface of the recess is an internal bottom surface of the recess.

A support structure for a micro-vibrator includes: a micro-vibrating body having a curved surface portion and a recess recessed from the curved surface portion; and a support member having a rod and an adhesive member arranged at a tip end of the rod. The support member is adhered on a connecting surface of the recess through the adhesive member. The connecting surface of the recess is an internal bottom surface of the recess.