A device for local temperature measurement that is suitable for taking temperature measurements of an immediate vicinity of said device. The device comprises: a cell comprising a heat-conductive base and at least one first material having a predetermined fixed state-change temperature and arranged in said base; a heat-energy transfer device thermally connected to said base and said at least one first material; a local temperature measurement probe received in said base and in thermal contact with said at least one first material, the heat-energy transfer device being suitable for causing a change of state of said first material in order to carry out at least one metrological verification of the local temperature measurement probe. An associated cell and method for use are also provided.

A device for local temperature measurement that is suitable for taking temperature measurements of an immediate vicinity of said device. The device comprises: a cell comprising a heat-conductive base and at least one first material having a predetermined fixed state-change temperature and arranged in said base; a heat-energy transfer device thermally connected to said base and said at least one first material; a local temperature measurement probe received in said base and in thermal contact with said at least one first material, the heat-energy transfer device being suitable for causing a change of state of said first material in order to carry out at least one metrological verification of the local temperature measurement probe. An associated cell and method for use are also provided.

A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.

A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.

A technique for measuring the resistance of a resistive element 4 in the presence of a series diode is provided. By supplying three different currents I.sub.1, I.sub.2, I.sub.3 and measuring corresponding voltages V.sub.1, V.sub.2, V.sub.3 across the resistive element and diode, the voltages can be combined to at least partially eliminate an error in the measured resistance of the resistive element caused by a voltage drop across the diode. A technique for current control in an array of resistive elements is also described in which a column of resistive elements is provided with two or more current sources switched so that while one current source is providing current to the column line corresponding to a selected resistive element, another current source has its amount of current adjusted.

An energy meter apparatus includes a sensing unit including a first temperature sensor configured to measure temperature of the fluid at a first boundary of the system and a processing-reporting unit comprising a second temperature sensor configured to measure temperature of the fluid at a second boundary of the system. One or both of a flow sensor and a pressure sensor is included in one of the sensing unit and the processing-reporting unit, and the pressure sensor is included in one of the sensing units and the processing-reporting unit. The processing-reporting unit is configured to establish and maintain a first wireless communication channel for communication with the sensing unit. The sensing unit is configured to report sensor measurements to the processing-reporting unit via the wireless communication channel.

An energy meter apparatus includes a sensing unit including a first temperature sensor configured to measure temperature of the fluid at a first boundary of the system and a processing-reporting unit comprising a second temperature sensor configured to measure temperature of the fluid at a second boundary of the system. One or both of a flow sensor and a pressure sensor is included in one of the sensing unit and the processing-reporting unit, and the pressure sensor is included in one of the sensing units and the processing-reporting unit. The processing-reporting unit is configured to establish and maintain a first wireless communication channel for communication with the sensing unit. The sensing unit is configured to report sensor measurements to the processing-reporting unit via the wireless communication channel.

A temperature sensing system includes absolute temperature sensor(s) and/or thermopiles that form concentric geometries and are uniform in height. In some examples, the temperature sensing system can determine internal body temperature and/or ambient temperature based at least on a thermal gradient associated with the inner thermopile, a thermal gradient associated with the outer thermopile, a lateral temperature difference between the inner and the outer thermopiles, and an absolute temperature. In some examples, the temperature sensing system can determine the internal body temperature and/or ambient temperature using at least four absolute temperature sensors forming a concentric structure.

A temperature sensing system includes absolute temperature sensor(s) and/or thermopiles that form concentric geometries and are uniform in height. In some examples, the temperature sensing system can determine internal body temperature and/or ambient temperature based at least on a thermal gradient associated with the inner thermopile, a thermal gradient associated with the outer thermopile, a lateral temperature difference between the inner and the outer thermopiles, and an absolute temperature. In some examples, the temperature sensing system can determine the internal body temperature and/or ambient temperature using at least four absolute temperature sensors forming a concentric structure.

A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.