An electronic component may include a carrier, and a thermoelectric sensor and a power transistor which are arranged on the carrier. The power transistor may include a base layer containing a transistor material chosen from among gallium nitride, aluminium gallium nitride, gallium arsenide, indium gallium, indium gallium nitride, aluminium nitride, indium aluminium nitride, and mixtures thereof. The electronic component may be configured so that the thermoelectric sensor generates an electric current under the effect of heating from the power transistor.

An electronic component may include a carrier, and a thermoelectric sensor and a power transistor which are arranged on the carrier. The power transistor may include a base layer containing a transistor material chosen from among gallium nitride, aluminium gallium nitride, gallium arsenide, indium gallium, indium gallium nitride, aluminium nitride, indium aluminium nitride, and mixtures thereof. The electronic component may be configured so that the thermoelectric sensor generates an electric current under the effect of heating from the power transistor.

The invention relates to a thermocouple (17) suspended from a part (26, 27) that can be locked onto a connecting section of the measuring stick, which comprises an opening in the form of a guiding cone (30) for inserting the thermocouple. The thermocouple is contained in a flexible cable (24) that can slide in a sheath (35) of the central compartment (16) which houses the thermocouple (17). A spring (34) can be added to lightly press the end of the thermocouple to the end of the housing thereof.

The invention relates to a thermocouple (17) suspended from a part (26, 27) that can be locked onto a connecting section of the measuring stick, which comprises an opening in the form of a guiding cone (30) for inserting the thermocouple. The thermocouple is contained in a flexible cable (24) that can slide in a sheath (35) of the central compartment (16) which houses the thermocouple (17). A spring (34) can be added to lightly press the end of the thermocouple to the end of the housing thereof.

A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.

A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.

In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

A temperature sensor comprises a temperature sensing element, a protective housing, and a heat transfer element. The temperature sensing element transduces a sensed temperature into an electrical output signal. The protective housing at least partly encases the temperature sensing element. The heat transfer element has an outer surface in heat conductive contact with an inner wall of the protective housing and receives at least a part of the temperature sensing element. The heat transfer element is formed separately from the temperature sensing element.

A temperature sensor comprises a temperature sensing element, a protective housing, and a heat transfer element. The temperature sensing element transduces a sensed temperature into an electrical output signal. The protective housing at least partly encases the temperature sensing element. The heat transfer element has an outer surface in heat conductive contact with an inner wall of the protective housing and receives at least a part of the temperature sensing element. The heat transfer element is formed separately from the temperature sensing element.