A semiconductor package includes a first set of leads, a temperature sensor proximate the first set of leads, a second set of leads, a semiconductor die, a first electrical connection between the temperature sensor and the semiconductor die, a second electrical connection between the semiconductor die and the second set of leads, and mold compound at least partially covering the temperature sensor, the semiconductor die, the first set of leads and the second set of leads. The mold compound physically separates the semiconductor die from the temperature sensor and the first set of leads.

A method for monitoring a line for a change in ambient conditions. The line includes a measurement line of a predetermined length which has a measuring conductor enclosed in an insulation with a known dielectric coefficient. An analog signal of defined frequency is generated and injected at a feed site. The signal is reflected at a predetermined reflection site and a resulting signal amplitude is measured at a defined measuring point. A measure for the ambient condition, particularly a temperature, is determined from the signal amplitude.

There is provided an apparatus for sensing temperature of an object. The apparatus includes a sensing element to be inserted into or placed adjacent to the object, the sensing element including a resonant circuit, and the resonant circuit having a temperature-dependent resonant frequency and including a capacitor. The apparatus further includes a detection unit configured to interface with the resonant circuit to receive a response associated with a current resonant frequency of the resonant circuit, and a control unit configured to determine the current resonant frequency of the resonant circuit based on the received response, and to determine the temperature of the object based on the determined current resonant frequency of the resonant circuit. The sensing element and the detection unit are physically unconnected.

A semiconductor device comprises a control unit, a semiconductor memory, a reference capacitance unit, a determination capacitance unit, a calibration circuit configured to supply a selection signal to the reference capacitance unit to selectively connect capacitors to differing potentials, and a determination circuit configured to charge a capacitance of the reference capacitance unit, to charge a capacitance of the determination capacitance unit, and to attain a comparison result by comparing the differing potentials. The control unit is configured to control rewriting of the semiconductor memory on the basis of a determination result of the determination circuit.

A semiconductor device includes first and second electrode pads for externally connecting two electrodes of a sensor capacitor that has a capacitance that changes according to an environmental change. The semiconductor device further includes a capacitor having a pair of electrodes, one of the pair of electrodes being connected to the first electrode pad, a capacitance circuit having a reference capacitance, and a determination circuit that includes first and second relay terminals. The determination circuit is configured to send a charging current from the first relay terminal to the other electrode of the capacitor and send a charging current from the second relay terminal to the capacitance circuit, and determine whether or not the size of a potential of the first relay terminal is greater than the size of a potential of the second relay terminal, thereby determining whether a capacitance of the sensor capacitor has changed or not.

Provided is a system for directly sensing, measuring, or monitoring the temperature of an electrical conductor (31) of a power cable (10). A temperature sensitive capacitor (21C) is disposed in direct thermal contact with the electrical conductor (31). The temperature sensitive capacitor (21C) includes a dielectric material that has a dielectric constant variable with the temperature of the electrical conductor (31). The temperature of the electrical conductor (31) can be sensed, measured, or monitored by measuring the capacitance of the temperature sensitive capacitor (21C).

Method, apparatus, and computer program product are provided for determining a maximum temperature to which a perishable good or other temperature sensitive item was exposed. In some embodiments, a capacitance of a circuit provided on a substrate is measured. The circuit includes capacitor(s) each having first and second plates separated from each other by an ionic liquid (IL) in a solid state. The IL melts at a predetermined temperature and flows away from the first and second plates into a void. In some embodiments, the predetermined temperature at which the IL melts is different for each capacitor. For example, each capacitor in the circuit may employ a different N-alkyl bezothiazolium salt. A maximum temperature of exposure is determined based on the measured capacitance. In some embodiments, a decision of whether to discard the perishable good or other temperature sensitive item may be based on the determined maximum temperature.

An electrostatic breakdown protection circuit and a capacitance sensor device are provided. An electrostatic breakdown protection circuit included in an electronic device including an external terminal and an internal circuit connected to the external terminal includes: a first series diode group in which n diodes including a first diode having an anode connected to the external terminal and a second diode having a cathode applied with a power supply voltage are connected in series; and a second series diode group in which n diodes including a third diode having a cathode connected to the external terminal and a fourth diode having an anode applied with a ground voltage are connected in series.

Devices, including wireless temperature sensors, are provided. The devices may include a patch including a conductive material, a substrate, and a ground plane. The devices may be used in the systems and methods provided herein to measure a temperature. The substrates of the devices may include a dielectric material or a metal.

Electrical or electronic control device has an electrical or electronic assembly, which includes a printed circuit board composed of an electrically insulating carrier material, electrically conductive conductor tracks formed on the printed circuit board, and electrical or electronic modules connected to the printed circuit board and via the conductor tracks. A coating is applied at least in sections to the electrical or electronic assembly. The coating includes at least the following layers: a first electrical conductor layer, a second electrical conductor layer, a dielectric layer arranged between the first conductor layer and the second conductor layer, an insulator layer applied to the second conductor layer in such a way that the second conductor layer is arranged between the dielectric layer and the insulator layer. An evaluation unit is connected to the conductor layers and detects a change in capacitance of the coating.