An electronic pressure and temperature sensor includes a chamber disposed within a housing. The pressure and temperature sensor are disposed at a chamber first end. An opening is disposed at a chamber second end, wherein the opening is configured to be in fluidic communication with the fluid media. A viscous gel is disposed within a portion of the chamber and encloses the pressure and temperature sensor apart from the fluid media. A second temperature sensor is at least partially disposed within the housing and is not disposed within the chamber. The first temperature sensor is configured to measure a temperature of the viscous gel, where the temperature of the viscous gel configured for use in temperature compensation calculations used to determine the pressure of the fluid media. The second temperature sensor is configured to measure a temperature of the flow of the fluid media.

A relative-pressure sensor determines the pressure of a medium in relation to an atmospheric pressure. The sensor includes a housing having a measuring element located in the housing, wherein the pressure to be measured acts upon an outer surface of the measuring element. The surface is in contact with the medium. The sensor also includes a reference-pressure supply, which supplies an inner surface of the measuring element with atmospheric pressure in the form of ambient air, and an evaluation unit, which determines the pressure of the medium from a variable determined using the measuring element. A drying chamber takes-up atmospheric humidity from the ambient air that is supplied via the reference-pressure supply. The drying chamber has a drying module comprising a container and a humidity-adsorbing material that is completely surrounded by the container.

A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

The present disclosure relates to a relative-pressure sensor for determining a pressure of a medium in relation to an atmospheric pressure, the sensor comprising a housing; a measuring element arranged in the housing, wherein the pressure to be measured acts upon an outer surface of the measuring element, said surface being in contact with the medium; a reference-pressure supply, which supplies an inner surface of the measuring element with atmospheric pressure in the form of ambient air; an evaluation unit, which determines the pressure of the medium from a variable determined using the measuring element; and at least one drying chamber arranged in the housing for taking up atmospheric humidity from the ambient air supplied through the reference-pressure supply. Here, a bushing is provided, which can be pressed into the housing and has a capillary-type groove, which is helical at least in sections and runs around the bushing.

A water detecting pressure-sensing device includes a metal housing including a cavity. A pressure sensor is disposed on a die and configured to generate a signal in response to a pressure variation. A protection medium at least partially fills the cavity and covers the die. One or more electrodes are disposed on the die and are used to detect a presence of a water droplet on the protection medium.

A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.

A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.

A micromechanical device that includes a carrier substrate; a sensor device that is situated on the carrier substrate and spaced apart from a surface section of the carrier substrate with the aid of spring elements in such a way that the sensor device is oscillatable relative to the surface section; and at least one stopper element, situated on the sensor device and/or on the surface section of the carrier substrate, which limits a deflection of the sensor device in the direction of the surface section.

A thermal management system for a sensor module is disclosed that includes a housing enclosing the sensor module and having a bottom wall with a reception port formed therein, and a thermal isolation puck installed within the reception port formed in the bottom wall of the housing for reducing the rate at which thermal energy from a heater located within an adjacent flush static plate is lost to the housing.

Apparatus and Method for the Detection of Properties of a Pipe There is described herein a system for determining one or more properties of a pipe, the system comprising an attachment pad, at least one sensor configured to be coupled to the outside of a pipe wall, wherein the attachment pad is configured to overlie one or more of the at least one sensor such that the one or more sensor may be positioned between the pipe and the attachment pad, and to prevent slippage of the one or more sensor on the pipe. There is also described an attachment pad, a sensor, and a pipe.