A pressure sensor comprises a substrate and a conductive layer disposed on the substrate and a spacer layer having a thickness larger than the thickness of the conductive layer. The pressure sensor also comprises an elastic membrane connected to the spacer layer, which overlays the conductive layer with the spacer layer providing a space therebetween and a sensing electrode layer arranged on a lower surface of the elastic membrane and spaced apart from the conductive layer. The sensing electrode layer forms at least two electrodes opposed and spaced apart from each other. The two electrodes are respectively connected to respective connectors and contact the conductive layer in response to an applied pressure on the elastic membrane. Each electrode transmits an output signal of resistance data to a processor through the respective connector.

Fully-passive sensor systems that receive an input electromagnetic signal and return an output electromagnetic signal are described. The sensor systems can be used to measure pressure in biological or non-biological systems.

A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and the maximum height is 0.5-0.8 mm, thereby potentially providing a compact sensor.

Fully-passive sensor systems that receive an input electromagnetic signal and return an output electromagnetic signal are described. The sensor systems can be used to measure pressure in biological or non-biological systems.

A pressure sensor according to the present invention includes a diaphragm (3) including a first principal surface (3A) and a second principal surface (3B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip (1) provided with resistors that constitute a strain gauge; and at least three support members (2a, 2b, 2c) made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members (2a) is provided at a center (30) of the diaphragm in plan view. At least two of the other support members (2b, 2c) are provided at positions point-symmetrical about the center of the diaphragm in plan view in a region in which the diaphragm is deformed when a pressure greater than a pressure applied to the second principal surface is applied to the first principal surface.

According to an embodiment of the inventive concept, a pressure sensor package may be disposed in an inner space of an electronic device. The pressure sensor package may include a substrate in which a hole is defined, a pressure sensor disposed on one surface of the substrate to cover the hole and including a membrane, and an insulator disposed on the pressure sensor to cover at least a portion of the membrane. The pressure sensor may be disposed to detect a first pressure of the inner space of the electronic device, which is caused by air flowing through the hole, and a second pressure caused by an external force applied to the electronic device through the insulator.

A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and with a maximum height of 0.5-0.8 mm, thereby provide a potentially economical filter element having a compact sensor.

A pressure sensor according to the present invention includes a diaphragm (3) including a first principal surface (3A) and a second principal surface (3B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip (1) provided with resistors that constitute a strain gauge; and at least three support members (2a, 2b, 2c) made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members (2a) is provided at a center (30) of the diaphragm in plan view. At least two of the other support members (2b, 2c) are provided at positions point-symmetrical about the center of the diaphragm in plan view in a region in which the diaphragm is deformed when a pressure greater than a pressure applied to the second principal surface is applied to the first principal surface.

A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and the maximum height is 0.5-0.8 mm, thereby potentially providing a compact sensor.

A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and with a maximum height of 0.5-0.8 mm, thereby provide a potentially economical filter element having a compact sensor.