In alternative embodiments, provided are moir profilometry methods for analyzing a topography of an object comprising use of dual patterns that are simultaneously projected onto a surface of the object from two symmetric directions. In alternative embodiments, the projected dual patterns superimpose and generate a fringe pattern that contains a moir pattern, the moir pattern having a phase that is modulated according to the topography of the object. In alternative embodiments, the moir pattern is extracted from the fringe pattern using a spatial or temporal method, and the phase is demodulated from the extracted moir pattern using a spatial or temporal method.