A composite sensor includes a first sensor outputting a first sensor signal, a second sensor outputting a second sensor signal, a circuit board electrically connected to the first and second sensors, and a mount member having one surface on which the first and second sensors and the circuit board are disposed. The first and second sensors have respective input terminals to which respective input signals are inputted, and have respective output terminals from which the first and second sensor signals are outputted. When a virtual straight line passing respective centers of the first and second sensors parallel to an arrangement direction of the sensors is defined, the respective input terminals of the first and second sensors are disposed in one of two regions divided by the virtual line, and the respective output terminals of the first and second sensors are disposed in a remaining one of the two regions.

The purpose of the present invention is to improve the pressure resistance of a cavity in a semiconductor sensor device employing a resin package, and to do so without adversely affecting the embeddability of an electrically conductive member. The semiconductor sensor device has a gap 1a sealed in an airtight manner inside a laminate structure of a plurality of laminated substrates 1, 4, and 5, and has a structure in which the outside of the laminate structure is covered by a resin, wherein a platy component 2 having at least one side that is greater in length than the length of one side of the gap 1a along this side is arranged to the outside of an upper wall 1b of the gap 1, the upper wall 1b of the gap being mechanically suspended by the platy component 2.

An accelerometer comprising a first proof mass and a second proof mass which are coupled to each other with a coupling structure which extends from the first proof mass to the second proof mass. The coupling structure synchronizes the movement of the first and second proof masses so that the first and second proof masses may be linearly displaced from their rest position in the x-direction, rotationally displaced in opposite in-plane directions and rotationally displaced in opposite out-of-plane directions.

A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

Provided is a physical quantity sensor including: a movable body; a base body; and a lid body, in which the movable body is accommodated in a space between the base body and the lid body, the space is sealed with a melt portion obtained by melting a through hole provided in the lid body, the lid body and the melt portion contain silicon, and the melt portion has a continuous curved surface having unevenness.

An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.

An acceleration sensor as a physical quantity sensor includes: a substrate; a correction electrode fixed to the substrate; a detection electrode fixed to the substrate; and a moving member fixed to the substrate. The moving member has: a base part; a first anchor part fixed to the substrate; a first finger electrode extending from the base part and facing the correction electrode; a mass part provided in such a way as to be displaceable in a direction of detection of a physical quantity in relation to the substrate; and a second finger electrode extending from the mass part and facing the detection electrode. A distance between a second anchor part where the detection electrode and the substrate are fixed, and the base part, is shorter than a distance between the second anchor part and the mass part.

A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass along a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary and one secondary stopper elements. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.

A physical quantity sensor includes a physical quantity sensor element including a lid joined to a substrate to define a housing space in the inside and a physical quantity sensor element piece housed in the housing space and a circuit element bonded to the outer surface of the lid via an adhesive material. In the lid, an electrode is provided to extend from an inner wall of a through-hole, which pierces through the lid from the housing space to a surface on the opposite side of the side of the physical quantity sensor element piece and is sealed by a sealing member, to a peripheral edge of the through-hole at the surface on the opposite side. In a sectional view, thickness of a region at the peripheral edge of the electrode is smaller at the opposite side of the side of an opening of the through-hole than the opening side.