The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

A Z-axis structure in an accelerometer comprises a mass block (1) moving relative to a substrate (4) in a Z-axis direction in a reciprocating manner. A first movable electrode plate (10) and a second movable electrode plate (11) are disposed on a sidewall of the mass block (1). A first fixed electrode plate (20) and a second fixed electrode plate (30) extending toward a plane consisting of an X axis and a Y axis are also disposed on the sidewall of the mass block (1). According to the Z-axis accelerometer, a lower plate structure is discarded, therefore the limitation of a lower plate to the Z-axis accelerometer is avoided, the mass block (1) can move up and down in the Z-axis direction, rather than moving in a teeterboard moving manner, the parasitic capacitance of the Z-axis accelerometer is reduced, and the detection precision is improved; the contact between the movable mass block (1) and the substrate (4) is avoided, and therefore the chip reliability is improved; the mass block (1) and the fixed electrodes are located at a same layer, therefore the consistence is superior to that of the traditional Z-axis structure; in addition, anchor points can be centralized in design, so as to reduce the sensitivity of a chip to the changes of the temperature and stress.

Microelectromechanical sensor comprising a fixed part and a mobile part suspended from the fixed part such that the mobile part can move at least in an out-of-plane displacement direction, the fixed part comprising at least first electrodes extending parallel to the displacement direction of the mobile part, the mobile part comprising a seismic mass and at least second electrodes extending parallel to the out-of-plane displacement direction, the first electrodes and the second electrodes being located relative to each other so as to be interdigitated, in which the second electrodes are directly connected to the inertial mass and only part of the face of each mobile electrode is facing an electrode fixed at rest.

There is provided an angular velocity sensor including first and second mass bodies provided within a first frame, a first flexible connector system connecting the first and second mass bodies and the first frame and that includes at least one sensor to detect displacements of the first and second mass bodies, a second flexible connector system connecting the first frame to a second frame provided separate from the first frame and that includes a driver to drive movement of the first frame relative to the second frame, so angular velocities can be measured based on the first and second mass bodies being enabled to rotate in a first axis direction and translated in a second axis direction, and based on the first frame being flexibly connected to the second frame so that a rotation displacement of the first frame is made in a third axis direction.

The present invention discloses a Z-axis structure of an accelerometer and a manufacturing method of the Z-axis structure. The Z-axis structure comprises a substrate, fixed electrodes and a mass block, wherein first anchor is arranged on a surface of the substrate; the fixed electrode is connected onto the corresponding first anchor at an end thereof; the fixed electrode is suspended above the substrate via the first anchor; an intermediate anchor is also arranged on the surface of the substrate; and the mass block is suspended above the fixed electrode via the intermediate anchor. In the Z-axis structure of the present invention, the fixed electrode is connected to the substrate by the first anchor, so that there is certain gap between the fixed electrode and the substrate. Because of the gap, the path for deformation to transmitting from the substrate to the fixed electrode is cut off, such that contact area between the fixed electrode and the substrate is reduced, effectively preventing the deformation of the substrate caused by changes of external stress and temperature from transmitting to the fixed electrode, and greatly reducing zero point offset of a Z-axis structure.

Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.

A MEMS self-aligned high-and-low comb tooth and manufacturing method thereof, the comb tooth having a lifting structure, the lifting structure generating a displacement in the vertical direction to drive the movement of a movable comb tooth or a fixed comb tooth attached thereto. The manufacturing method thereof adopts a silicon wafer, the lifting structure and the comb tooth are sequentially formed on a mechanical structure layer, the fixed comb tooth and the movable comb tooth are formed with the same etching process, and the stress in the lifting structure displaces the fixed comb tooth and the movable comb tooth in the vertical direction, thus forming the self-aligned high-and-low comb tooth.

The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

A vibration rectification error correction circuit includes a first correction circuit that obtains a digital value based on a signal to be measured output from a sensor element configured to measure a physical quantity and corrects a vibration rectification error of the digital value by a correction function based on a product of values obtained by biasing the digital value.

Microelectromechanical sensor comprising a fixed part and a mobile part suspended from the fixed part such that the mobile part can move at least in an out-of-plane displacement direction, the fixed part comprising at least first electrodes extending parallel to the displacement direction of the mobile part, the mobile part comprising a seismic mass and at least second electrodes extending parallel to the out-of-plane displacement direction, the first electrodes and the second electrodes being located relative to each other so as to be interdigitated, in which the second electrodes are directly connected to the inertial mass and only part of the face of each mobile electrode is facing an electrode fixed at rest.