Patent classifications
G01R1/0408
ELECTRICAL TREE TEST DEVICE FOR SILICONE RUBBER MATERIAL FOR CABLE ACCESSORY AND METHOD FOR PREPARING SAMPLE
Provided are an electrical tree test device for a silicone rubber material for a cable accessory and a method for preparing a sample. The method includes: adding a semi-conductive silicone rubber into xylene, performing spraying on a surface of a silicone rubber insulation sample sheet, performing a curing processing, cutting the sample sheet into a high-voltage electrode with a triangular longitudinal section end, then adhering the high-voltage electrode on the surface of the silicone rubber insulation sample sheet, and performing a high temperature vulcanization to obtain a silicon rubber sample sheet; placing the silicon rubber sample sheet into a mold, injecting a high temperature vulcanizable liquid silicone rubber mixture, and performing the high temperature vulcanization, to obtain a sample; and performing cutting at a position distanced from a tip of the high-voltage electrode by 2 mm, and adhering a ground electrode of a flat plate-like structure at the cross section/
Adapter for connecting battery and electrical device
An adapter may be configured to connect a battery and an electrical device to each other. The adapter may include a control board; a battery-side terminal mounted on a first surface of the control board and configured to be electrically connectable to the battery; and a device-side terminal mounted on a second surface of the control board and configured to be electrically connectable to the electrical device, the second surface being opposite from the first surface.
Electrical panel adapter providing pass through access to electrical signals within an enclosure
An electrical panel adapter for an enclosure that is formed of at least one panel includes a main unit having a front portion and a rear portion. The rear portion is positioned inside the enclosure and includes a first plurality of electrical connections adapted to connect to electrical wires and/or equipment located inside the enclosure. The front portion extends through an aperture in the at least one panel and includes a second plurality of electrical connections adapted to connect to one or more electrical devices located outside the enclosure for measurement of both voltage and current inside the enclosure. The second plurality of electrical connections are electrically coupled to the first plurality of electrical connections. The electrical panel adapter enables electrical devices outside the enclosure to be electrically coupled to the electrical wires and/or equipment inside the enclosure without requiring the enclosure to be opened.
Low insertion force connector assembly and semiconductor component test apparatus
A low insertion force connector assembly includes a first connector and a second connector which are detachably coupled to each other, wherein the first connector and the second connector are easily assembled to prevent contact failure and are firmly assembled to each other to improve dimensional stability, and it is easy to assemble and manufacture the connectors.
SAMPLE FIXATION MECHANISM FOR TEST WITH NANO-PROBE, APPARATUS FOR TEST AND SAMPLE TEST METHOD
The present disclosure discloses a sample fixation mechanism for a test with a nano-probe, an apparatus for a test with a nano-probe, and a sample test method. The sample fixation mechanism includes a base having a first assembly surface; a holder having a second assembly surface matched with the first assembly surface, wherein the holder further has a fixation surface opposite to the second assembly surface, and the fixation surface is configured to be adhered and fixed with the sample; a lock structure having a locked state and an unlocked state, wherein in the locked state, the lock structure is capable of fixing the holder relative to the base, and in the unlocked state, the holder may be removed from the base.
Test apparatus which tests semiconductor chips
A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.
TEST BOARD FOR TESTING MEMORY SIGNAL
A test board for testing a memory signal includes a first surface and a second surface. The first surface of the test board comprises a convex region and a non-convex region. The convex region is provided with a first connection area connectable to a main board, and a level at which the convex region is located is higher than a level at which the non-convex region is located by a preset value. The second surface of the test board includes a test area and a second connection area connectable to a memory chip. The test board is provided with a first connection harness for connecting the test area to the first connection area and a second connection harness for connecting the test area to the second connection area, to enable the memory signal of the memory chip to be tested based on the test area.
TEST SOCKET FOR PERFORMING A TEST ON AN ELECTRONIC DEVICE
A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.
Ceramic, probe guiding member, probe card, and socket for package inspection
A ceramic contains, in mass percent: Si.sub.3N.sub.4: 20.0 to 60.0%, ZrO.sub.2: 25.0 to 70.0%, and one or more oxides selected from MgO, Y.sub.2O.sub.3, CeO.sub.2, CaO, HfO.sub.2, TiO.sub.2, Al.sub.2O.sub.3, SiO.sub.2, MoO.sub.3, CrO, CoO, ZnO, Ga.sub.2O.sub.3, Ta.sub.2O.sub.5, NiO, and V.sub.2O.sub.5: 5.0 to 15.0%. The ceramic has a coefficient of thermal expansion as high as that of silicon and an excellent mechanical strength, allows fine machining with high precision, and prevents particles from being produced.
Assembly for Checking the Functionality of a Measuring Object
The invention is an assembly for checking the functionality of a measuring object, that is a DUT, in a medical implant or at least one part of the medical implant. The assembly comprises a test signal generator, a test module that is connected to the test signal generator. The assembly has a first receiving structure with at least one contact electrode, into which an adapter rigidly connects to the DUT in a releasable manner which is inserted to form least one electrical contact. A control and analysis unit is connected to the test signal generator and to the test module in a wired or wireless manner.