The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

A testing head for functionality testing a device under test comprises a plurality of contact probes, each contact probe having a rod-like body having a preset length less than 5000 μm extending between a first and a second end, the second end being a contact tip and an opening extending all over its length and defining a plurality of arms, parallel to each other, separated by the opening and connected to the end portions of the contact probe, and an auxiliary guide, arranged transverse to the body and provided with suitable guide holes, the contact probes sliding through each of them, the auxiliary guide defining a gap including one end of the opening being a critical portion of the body and a zone more prone to breakings in the body undergoing low or even no bending stresses in the gap with respect to the rest of the body.

An example probe for a test system includes a conductor to carry direct current (DC) signals between a DC testing resource and a signal trace on the test system, where the signal trace is for carrying the DC signals and alternating current (AC) signals to and from a device under test; and an inductor connected in series with the conductor. A mechanism is included in the probe for enabling the conductor to move toward the signal trace or a pin electrically connected to the signal trace to create an electrical connection between the conductor and the signal trace to enable the testing resource to transmit the DC signals to the signal trace, and to move away from the signal trace or the pin so that no electrical connection is created between the conductor and the signal trace when the DC signals are not to be transmitted to the signal trace.

The present disclosure is an inspection apparatus that makes an inspection of electrical characteristics of an object to be inspected. using a contactor brought into electrical contact with an electrode of the object to be inspected, the inspection apparatus including: a position adjusting unit including the contactor, a position adjusting section that adjusts a tip position of the contactor, and a load. detecting section that detects a value of contact load between the contactor and the electrode; a position deriving section that derives an initial position of the contactor in a specific direction based on a relationship between an amount of contact displacement of the contactor in the specific direction and the value of contact load between the contactor and the electrode; and a movement performing section that moves the tip position of the contactor based on the initial position in the specific direction derived by the position deriving section.

A jig (30) includes a first block portion (100) at which a probe head (300) is installed, and a first suction port (112) formed on the first block portion (100). Air present on a side where one end of a probe (330) provided in the probe head (300) is located is sucked from the first suction port (112).

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die tow the upper die by a plate. The probe pin is picked from the probe head by an arm.

A wafer test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.

A probe tip for an isolated probe having a triaxial cable has a conductive probe tip interface at one end of the cable, a signal conductor, the signal conductor traversing a length of the cable and electrically connected to the conductive probe tip interface, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor at least along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the probe tip, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor. A method of manufacturing a tip for an isolated probe having a triaxial cable includes accessing a shield conductor of the triaxial cable, inserting a high magnetic permeability material between the shield conductor and a reference conductor in the triaxial cable, electrically connecting the shield conductor to the reference conductor. A triaxial cable has a signal conductor, the signal conductor traversing a length of the cable, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the cable, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor.

Provided is an immunity evaluation system that enables design feedback in consideration of a subject wiring and an improvement amount for improving an electromagnetic noise resistance of a circuit board. An immunity evaluation device includes: a storage unit configured to store characteristic data including probe-circuit board wiring coupling characteristics which are determined by a combination of a near-field probe and circuit board characteristics, and a test result; and an IC reaching signal level estimation unit configured to estimate a signal level reaching a terminal of an evaluation target IC. The immunity evaluation device receives board design information, information of the near-field probe, and test waveform instruction information of a signal applied to the near-field probe. The IC reaching signal level estimation unit reads the coupling characteristics from the storage unit based on the board design information of a test subject circuit board and the information of the near-field probe, and outputs a value of the IC reaching signal level reaching a terminal of the evaluation target IC from the board design information of the test subject circuit board, the information of the near-field probe, and the coupling characteristics.

The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.