The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

An instrument interface method and device. Two capacitors, one capacitor has one end as input of the device, connected to live line of power output of a LISN, and has other end as output of the device, connected to one test port of an oscilloscope; the other capacitor has one end as input of the device, connected to neutral line of the power output of the LISN, and has other end as output of the device, connected to another test port of the oscilloscope; without changing the LISN design, existing LISN products can be used for conducted emission test with oscilloscope-based time-domain EMI measurement instruments by means of the method and device. Said two capacitors have a capacity of <0.09 μF, which reduced the requirements of oscilloscope's A/D conversion, making low-cost oscilloscope can also be used for EMI testing.

Evaluation board (EVB) assemblies or stacks utilized in tuning electronic modules are disclosed, as are methods for tuning such modules. In embodiments, the module testing assembly includes an EVB and an EVB baseplate. The EVB includes, in turn, an EVB through-port extending from a first EVB side to a second, opposing EVB side; and a module mount region on the first EVB side and extending about a periphery of the EVB through-port. The module mount region is shaped and sized to accommodate installation of a sample electronic module provided in a partially-completed, pre-encapsulated state fabricated in accordance with a separate thermal path electronic module design. A baseplate through-port combines with the EVB through-port to form a tuning access tunnel providing physical access to circuit components of the sample electronic module through the EVB baseplate from the second EVB side when the sample electronic module is installed on the module mount region.

The present disclosure relates an interface unit having an input for receiving an input voltage from an electrochemical measuring probe; a first transistor; a first operational amplifier; a second transistor; and a second operational amplifier. The first operational amplifier is arranged to provide a variable tension to a first source terminal of the first transistor, in accordance with a comparison between a reference voltage and a second resistor voltage, in order to control an operating point of the first transistor.

A probe device includes a first receiving terminal configured to receive a multi-level signal having M levels, where M is a natural number greater than 2; a second receiving terminal configured to receive a reference signal; a receiving buffer including a first input terminal connected to the first receiving terminal, a second input terminal connected to the second receiving terminal, and an output terminal configured to output the multi-level signal based on signals received from the first and second input terminals; and a resistor circuit comprising a plurality of resistors connected to the first and second receiving terminals and determining a magnitude of a termination resistance of the first and second receiving terminals.

Evaluation board (EVB) assemblies or stacks utilized in tuning electronic modules are disclosed, as are methods for tuning such modules. In embodiments, the module testing assembly includes an EVB and an EVB baseplate. The EVB includes, in turn, an EVB through-port extending from a first EVB side to a second, opposing EVB side; and a module mount region on the first EVB side and extending about a periphery of the EVB through-port. The module mount region is shaped and sized to accommodate installation of a sample electronic module provided in a partially-completed, pre-encapsulated state fabricated in accordance with a separate thermal path electronic module design. A baseplate through-port combines with the EVB through-port to form a tuning access tunnel providing physical access to circuit components of the sample electronic module through the EVB baseplate from the second EVB side when the sample electronic module is installed on the module mount region.

An apparatus for providing a test signal from a device under test (DUT) to a measurement instrument is disclosed. The apparatus includes a probe head configured to receive an electrical signal from the DUT. The probe head includes an electro-optic modulator. The apparatus also includes a control box, which includes an optical source. The optical source is configured to provide an input optical signal to the electro-optic modulator, which is configured to provide an output optical signal based on the electrical signal from the DUT. The control box also includes an optical bias control circuit. Only a bias control signal is provided to the electro-optic modulator.

Systems and methods for monitoring current anomaly are described. In an example, a device can measure first current flowing along a first liner between an instrument to an equipment. The device can measure second current flowing along a second line between the equipment to the instrument. The device can compare the measurements of the first current and the second current. The device can identify a presence of current anomaly based on the comparison of the measurements of the first and second currents. The device can, in response to the presence of the current anomaly, disconnect the instrument from the equipment.

A clamp-type AC voltage probe includes: a clamp portion that clamps a cable to be measured; an electrode disposed to be opposed to the cable clamped by the clamp portion; a parallel circuit in which a capacitor and a resistance are connected in parallel, and one end of which is connected to the electrode; a resistance one end of which is connected to the other end of the parallel circuit and the other end of which is connected to a circuit ground; a capacitor one end of which is connected to the other end of the parallel circuit and the other end of which is connected to the circuit ground; and an amplifier an input terminal of which is connected to the one end or the other end of the parallel circuit, and that amplifies and outputs a signal input into the input terminal.

A test and measurement probe system (100,104), including an input (106) to receive an input signal, the input signal including a low frequency (LF) and/or direct current (DC) component and an alternating current (AC) component, an extractor circuit (110), such as an AC coupling circuit or a LF and/or DC rejection circuit, configured to receive the input signal and to separate the AC component and the LF and/or DC component from the input signal, a first output (118) to output the alternating current component to the test and measurement instrument, and a second output to output the direct current component to the test and measurement instrument. In some embodiments, the LF and/or DC component is digitized prior to being output by the second output.