High voltage assemblies and detectors are provided. In one aspect, a high voltage assembly includes a high voltage base board and a plurality of sub-detectors. Each sub-detector includes a crystal substrate, a crystal, a high voltage transfer board, and a high voltage cathode board. One of the high voltage transfer board and the high voltage base board includes first and second connection members, and the other one includes first and second contact members. The first connection member is configured to shift relative to the first contact member in response to a first force, and the second connection member is configured to shift relative to the second contact member in response to a second force. A high voltage is applied at both ends of the crystal through electrically contacting the first connection member with the first contact member and electrically contacting the second connection member with the second contact member.

An apparatus for providing a test signal from a device under test (DUT) to a measurement instrument is disclosed. The apparatus includes a probe head configured to receive an electrical signal from the DUT. The probe head includes an electro-optic modulator. The apparatus also includes a control box, which includes an optical source. The optical source is configured to provide an input optical signal to the electro-optic modulator, which is configured to provide an output optical signal based on the electrical signal from the DUT. The control box also includes an optical bias control circuit. Only a bias control signal is provided to the electro-optic modulator.

The present disclosure relates to voltage sensing mechanisms. One example embodiment includes a voltage-measurement device. The voltage-measurement device includes a housing. The voltage-measurement device also includes an extendible gripper configured to be removably attached to a wire under test. Additionally, the voltage-measurement device includes at least one power supply. Further, the voltage-measurement device includes a power management chip electrically coupled to the at least one power supply and configured to manage a range of input voltages from the at least one power supply. The power management chip comprises a synchronous boost voltage regulator. Additionally, the voltage-management device has a microprocessor electrically coupled to the power management chip and the extendible gripper. The microprocessor is configured to receive electrical power from the power management chip. The microprocessor is also configured to receive an electrical signal from the extendible gripper indicative of a voltage associated with the wire under test.

A direct current (DC) power rail probe includes a single-ended probe tip, and a two-path circuit having an input coupled to the single-ended probe tip and an output configured for connection to measurement equipment such as an oscilloscope. The two-path circuit includes an alternating current (AC) path in parallel with a feed-forward (FF) path, the AC path including a capacitive element, and the FF path including a series connection of at least one resistive element and an amplifier. The probe tip and two-path circuit are selectively operable in a non-attenuating mode and an attenuating mode.

An electrical probe includes a base body and a probe head. The base body has a main body portion and at least one positioning portion, and the positioning portion protrudes from the main body portion. The probe head is detachably disposed on the main body portion of the base body. The probe head has an outer edge away from a side of a central axis of the main body portion, and the positioning portion protrudes from the outer edge.

A high voltage phasing voltmeter comprises first and second probes. Each probe comprises an electrode for contacting a high voltage electrical conductor. The electrodes are connected in series with a resistor. A meter comprises a housing enclosing an electrical circuit for measuring true rms voltage. The electrical circuit comprises an input circuit for connection to the first and second probes and developing a scaled voltage representing measured voltage across the electrodes. A converter circuit converts the scaled voltage to a DC signal representing true rms value of the measured voltage. A peak hold circuit is connected to the converter circuit to hold a peak value of the true rms value. A display is connected to the peak hold circuit for displaying the peak value of the true rms value.

A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.

A system and method for monitoring power lines comprises a plurality of sensory assemblies each connected to a phase of a power line and comprising a sensory transceiver that transmits a signal comprising a digital representation of a voltage wave and a current wave on a single phase of a power line. A common assembly comprising a common transceiver receiving the signal from each sensory transceiver and a microprocessor. A precision timing device directs the common transceiver to send signals to each of the sensory assemblies to synchronize the sensory assembly reading on a phase of a power line. The microprocessor for analyzing the timed signals synchronized for a plurality of phases by determining the net real time sum of the current of the plurality of phases to determine ground or neutral current and for determining instantaneous voltage between any two phases.

An example contact head includes coaxial contacts configured for transmission of radio frequency (RF) signals or digital signals between a test system and a device under test (DUT). Each of the coaxial contacts is configured to target a specific impedance. Each of the coaxial contacts includes a coaxial structure having an open-curve shape. The coaxial structure includes a spring material that bends in response to applied force and that returns to the open-curve shape absent the applied force. The coaxial structure includes a center conductor terminating in a contact pin and a return conductor separated by a dielectric from the center conductor. At least part of the center conductor and the return conductor include an electrically-conductive material. Flexible contacts on the coaxial contact include the electrically-conductive material.

A probe card for testing power devices under high temperature and high voltage. The probe card includes air inlet system, PCB board, switching layer, guide plate and probe from top to bottom; the bottom of air inlet system includes plurality of lower air outlets and side air outlets, the PCB board includes a first through-hole with same position, shape and quantity as the lower air outlet, the switching layer includes a second through-hole with same position, shape and quantity as the lower air outlet, the guide plate includes a third through-hole with same position, shape and quantity as the lower air outlet. The lower air outlet, the first through-hole, the second through-hole and the third through-hole are coaxially arranged. The high-temperature and high-pressure gas ejected from the lower air outlet is blown between the guide plate and the tested wafer after successively passing through the first, second, and third through-holes.