Disclosed is a detector 10 using a liquid spray 2000 for detecting electrical faults or shorts with the detector including a body 100 having an interior 120; a hose or pipe 130 fluidly connected to interior 120; a trigger valve 140 operatively connected to hose 130; a conductor 200 attached to detector 10; and/or a pump 110 fluidly connected to interior 120. In various embodiments the detector 10 can cause liquid spray 2000 to be sprayed on a subregion of an item such as a remotely operated vehicle to create a closed electrical circuit through the liquid spray and the conductor in the detector.

The present disclosure provides an apparatus for illumination inspection of micro LEDs. An apparatus for illumination inspection of micro LEDs includes a surface-contact probe making a surface contact, through an electrical resistive material, with a front surface of an LED assembly of multiple micro LEDs arranged forwardly and interconnecting LED electrodes at both ends of the micro LEDs, probe electrodes to be in line contact with one side and the other side of the surface-contact probe for supplying electric power, an imaging unit for photographing the LED assembly from an opposite surface of the surface-contact probe, to where the surface-contact probe is contacted, and a control unit for supplying electric power to the probe electrodes forwardly along the micro LEDs as aligned and for inspecting the micro LEDs illumination based on images of the LED assembly photographed by the imaging unit before and after supplying the electric power.

The present disclosure provides an apparatus for illumination inspection of micro LEDs. An apparatus for illumination inspection of micro LEDs includes a surface-contact probe making a surface contact, through an electrical resistive material, with a front surface of an LED assembly of multiple micro LEDs arranged forwardly and interconnecting LED electrodes at both ends of the micro LEDs, probe electrodes to be in line contact with one side and the other side of the surface-contact probe for supplying electric power, an imaging unit for photographing the LED assembly from an opposite surface of the surface-contact probe, to where the surface-contact probe is contacted, and a control unit for supplying electric power to the probe electrodes forwardly along the micro LEDs as aligned and for inspecting the micro LEDs illumination based on images of the LED assembly photographed by the imaging unit before and after supplying the electric power.

A wafer probe test system has a conductive needle configured to contact a conductive feature on a surface of a wafer, and a fluid probe having a multichannel tube, the fluid probe configured to engage the surface of the wafer to form a fluidic seal between a sensor face on the surface of the wafer and the conductive feature of the wafer, the multichannel tube having a first channel and a second channel configured to create a flow of fluid across the sensor face on the surface of the wafer.

Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.

A semiconductor wafer evaluation apparatus brings a contact maker (mercury liquefied at room temperature), as a Schottky electrode, into contact with a semiconductor wafer, intermittently applies a voltage from a pulse power supply, and evaluates the state (kinds, density) of point defects by an evaluation means based on the status of the electrostatic capacity of the semiconductor wafer. In this manner, the state (kinds, density) of the point defects in the plane of a large-diameter semiconductor wafer is directly evaluated using a large table.

A test assembly for testing a device under test includes a probe card assembly and a cap secured to the probe card assembly. The probe card assembly includes a probe tile having a plurality of openings. The probe tile includes a plurality of probe wires including a probe needle portion and a probe tip portion. A seal is disposed on a surface of the probe tile and forms an outer perimeter of a pressurized area. The probe tile includes an insulation layer formed within the pressurized area that is configured to separate the probe needle portion from the device under test. The insulation layer includes an aperture through which the probe tip portion extends to contact the device under test. The cap includes a fluid inlet and a fluid return outlet that are in fluid communication with the plurality of openings of the probe tile.

An electrical-test apparatus is provided, which includes a plurality of tester interconnect structures cantilevered from a first side of a substrate. A base may be coupled to a second side of the substrate via one or more interconnect layers. The tester interconnect structures may contact corresponding interconnect structures of a device under test (DUT). In an example, the substrate is laterally movable relative to the DUT along a plane of the substrate, upon contact between the tester interconnect structures and the interconnect structures of the DUT.

The present disclosure relates to a method of depositing a fluid onto a substrate. In some embodiments, the method may be performed by mounting a substrate to a micro-fluidic probe card, so that the substrate abuts a cavity within the micro-fluidic probe card that is in communication with a fluid inlet and a fluid outlet. A first fluidic chemical is selectively introduced into the cavity via the fluid inlet of the micro-fluidic probe card.

An illustrative system disclosed herein includes a conductive probe that is adapted to hold a quantity of mercury, wherein the conductive probe includes a conductive body with an outlet and a mercury control system adapted to supply mercury to the conductive probe. In this example, the system also includes an image sensor that is adapted to obtain an image of a mercury droplet positioned on a surface of a material and a measurement system that is adapted to receive the image of the mercury droplet and calculate a contact area between the mercury droplet and the surface of the material based upon the image of the mercury droplet.