An electrical connecting device includes a probe head, and probes for measurement and probes for confirmation held by the probe head. The probe head holds the probes for measurement and the probes for confirmation in a state in which the respective tip ends are exposed therefrom. An exposed length from the probe head to the tip end is shorter for the probes for confirmation than for the probes for measurement.

A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe comprises a probe body, a first cantilever extending from the probe body, and a first thermal detector extending from the probe body. The thermal detector is used to position the cantilever with respect to a test sample.

The present disclosure is an inspection apparatus that makes an inspection of electrical characteristics of an object to be inspected. using a contactor brought into electrical contact with an electrode of the object to be inspected, the inspection apparatus including: a position adjusting unit including the contactor, a position adjusting section that adjusts a tip position of the contactor, and a load. detecting section that detects a value of contact load between the contactor and the electrode; a position deriving section that derives an initial position of the contactor in a specific direction based on a relationship between an amount of contact displacement of the contactor in the specific direction and the value of contact load between the contactor and the electrode; and a movement performing section that moves the tip position of the contactor based on the initial position in the specific direction derived by the position deriving section.

Proposed are a probe head and a probe card having the same. The probe head includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; an intermediate guide plate having an intermediate guide hole, and provided between the upper guide plate and the lower guide plate; and a guide member provided at a side of the intermediate guide plate, wherein the intermediate guide plate is limited in movement by the guide member.

A probe adapter includes an adapter body including a probe aperture and a slot. The probe adapter further includes a driver slidably mounted within the slot and slidable between a first position and a second position. The driver includes a first end and a second end opposite the first end. The first end includes a ramped recess extending in a direction from the first end toward the second end. The probe adapter further includes a threaded fastener configured to contact the second end of the driver so as to retain the driver in the first position.

A semiconductor device with contact check circuitry is provided. The semiconductor device includes a plurality of pads, an internal circuit, and a contact check circuit. The plurality of pads includes a first pad and a second pad. The internal circuit is coupled to the plurality of pads. The contact check circuit, at least coupled to the first pad and the second pad, is used for checking, when the semiconductor device is under test, contact connections to the first pad and the second pad to generate a check result signal according to comparison of a first test signal and a second test signal received from the first pad and the second pad with at least one reference signal.

An inspection system includes a plurality of inspection apparatuses, and a data processing apparatus capable of communicating with the plurality of inspection apparatuses. The data processing apparatus includes a storage part storing a model that determines a causal relationship between an apparatus parameter related to setting of the plurality of inspection apparatuses and index data obtained when the plurality of inspection apparatuses are operated, a collection part collecting the apparatus parameter and the index data, a determination part determining whether or not the index data is included in a predetermined allowable range, and a calculation part calculating an adjustment amount for adjusting the apparatus parameter, based on the apparatus parameter and the index data, and the model, when it is determined that the index data is not included in the predetermined allowable range.

A wafer test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.

A spring connector includes: an insulating housing having a through hole; a conductor disposed on one end side of the through hole; and a conductive external contact pin disposed on another end side of the through hole. The housing has an opening portion on the other end side of the through hole. A part of the through hole and a part of the conductor form an internal space. The external contact pin includes a tip end portion configured to protrude from the opening portion and a main body portion positioned in the through hole. The external contact pin and the conductor are configured to be switched between a non-conductive state and a conductive state by moving the tip end portion of the external contact pin in a backward direction opposite to a protruding direction in which the tip end portion protrudes from the opening portion.

Integrating a bracket with planarity adjustment holding a wafer probe securely, with a low-profile impedance tuner that is mounted on a 3-axis tuner positioner under an angle matching the angle of the wafer probe. The low-profile tuner has its tuning probe operating as close as physically possible within the distance of an RF adapter from the wafer-probe and is connected directly with the wafer-probe. This integration offers the maximum possible tuning range, while simultaneously offering planarity (THETA) control. It also eliminates the need for an extension RF cable between the instrument (tuner) and the wafer-probe, including a set of two coaxial adapters.