A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

The present disclosure relates to voltage sensing mechanisms. One example embodiment includes a voltage-measurement device. The voltage-measurement device includes a housing. The voltage-measurement device also includes an extendible gripper configured to be removably attached to a wire under test. Additionally, the voltage-measurement device includes at least one power supply. Further, the voltage-measurement device includes a power management chip electrically coupled to the at least one power supply and configured to manage a range of input voltages from the at least one power supply. The power management chip comprises a synchronous boost voltage regulator. Additionally, the voltage-management device has a microprocessor electrically coupled to the power management chip and the extendible gripper. The microprocessor is configured to receive electrical power from the power management chip. The microprocessor is also configured to receive an electrical signal from the extendible gripper indicative of a voltage associated with the wire under test.

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device.

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device.

A device (10) for detecting breakage of at least one electrical cable (12) has the at least one electrical cable (12), a wireless sensor (14) connected to the at least one electrical cable (12), and at least one power supply unit (18) supplying power to the wireless sensor (14). The at least one power supply unit (18) has a means (20) of applying a predetermined potential to the at least one electrical cable (12), and the wireless sensor (14) is designed to detect either the predetermined potential, which is an indicator of the integrity of the at least one electrical cable (12), or a floating potential, which is an indicator of the breakage of the at least one electrical cable (12).

A device (10) for detecting breakage of at least one electrical cable (12) has the at least one electrical cable (12), a wireless sensor (14) connected to the at least one electrical cable (12), and at least one power supply unit (18) supplying power to the wireless sensor (14). The at least one power supply unit (18) has a means (20) of applying a predetermined potential to the at least one electrical cable (12), and the wireless sensor (14) is designed to detect either the predetermined potential, which is an indicator of the integrity of the at least one electrical cable (12), or a floating potential, which is an indicator of the breakage of the at least one electrical cable (12).

The disclosed apparatus may include support portions, a frame (such as a base) configured to maintain the support portions in a spaced-apart configuration, a sample holder configured to receive a sample, and a probe assembly including micromanipulators configured to position one or more probes in contact with the sample. The sample holder may rotate between the support portions, and the probe assembly may rotate with the sample holder so that the one or more probes may maintain contact with a sample in the sample holder as the sample holder is rotated, for example, to expose a portion of the sample for processing. Various other methods, systems, and computer-readable media are also disclosed.

A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion.