The present invention relates to a state of charge (SOC) management system of an energy storage device, the system comprising at least one energy storage device, wherein the SOC management system of the energy storage device manages SOC of the energy storage device by performing P-f (active power-frequency) droop control on the basis of a droop coefficient, a reference frequency, and a dead band, which determine the output of each energy storage device.

A testing system for monitoring a machine under test is disclosed and includes one or more high frequency sensors configured to generate a sensor signal that is representative of an operating parameter of the machine. The high frequency sensors have a required high frequency sampling rate. The testing system also includes a notification device configured to generate a notification indicating the operating parameter monitored by the high frequency sensors has exceeded a predefined threshold value and a data acquisition control module configured to monitor the high frequency sensors at a first sampling rate. The testing system also includes a monitoring control module in electronic communication with the notification device. The monitoring control module is configured to monitor the high frequency sensors at a second sampling rate that is greater than the first sampling rate and at least equal to the required high frequency sampling rate.

A multi-frequency programmable and remotely controllable variable attenuator and phase shifter (MF-VAPS) network utilizes wideband three port circulators, power combiners, high-low pass filters and a calibrated multi-harmonic tuner to control the amplitude and phase of the transmission factor (A21) at up to three user defined frequencies individually. The harmonic signal components are divided in frequency bands and injected into the circulator's port 1 and extracted from port 3, whereas the tuner is connected to port 2 and terminated with Zo. When the tuner is initialized (S11=0) the transmission factor of the network is zero; when the tuner is at maximum reflection at any frequency the transmission factor is also maximum. Changing the reflection phase of the tuner controls the transmission phase <A21 by the same amount, up to 360°.

An arrangement for monitoring the operation of a machine intended to be tracked by a real-time locating system comprises: a tag intended to be arranged on the machine, the tag being configured to generate a wireless tag signal allowing determination of a position of the tag; and at least one detector intended to be arranged on the machine, the at least one detector being configured to detect at least one characteristic of a magnetic field generated by the machine. Detection of the at least one characteristic is indicative of the machine being operative. The arrangement makes it possible to obtain a detailed understanding of how the machine is used in a cost-effective manner. A real-time locating system comprising such an arrangement and a method for monitoring the operation of a machine are also disclosed.

An assembly including an insulated gate bipolar transistor (IGBT) is provided. The IGBT is coupled with a gate driver for receiving a gating signal to drive the IGBT and providing a feedback signal of the IGBT which indicates a change of a collector-emitter voltage of the IGBT. The assembly further includes a failure mode detection unit for determining whether the IGBT is faulted based on a timing sequence of the gating signal and feedback signal. The failure mode detection unit is capable of differentiating fault types including a gate driver fault, a failed turn-on fault, a short-circuit fault, a turn-on over-voltage fault and a turn-off over-voltage fault. Accordingly, an IGBT failure mode detection method is also provided.

A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

A testing system for monitoring a machine under test is disclosed and includes one or more high frequency sensors configured to generate a sensor signal that is representative of an operating parameter of the machine. The high frequency sensors have a required high frequency sampling rate. The testing system also includes a notification device configured to generate a notification indicating the operating parameter monitored by the high frequency sensors has exceeded a predefined threshold value and a data acquisition control module configured to monitor the high frequency sensors at a first sampling rate. The testing system also includes a monitoring control module in electronic communication with the notification device. The monitoring control module is configured to monitor the high frequency sensors at a second sampling rate that is greater than the first sampling rate and at least equal to the required high frequency sampling rate.

In described examples, a time-domain analyzer is arranged to generate an indication of a number of high-frequency events of an electrical monitor signal that includes a fundamental periodic frequency. The high-frequency events include frequencies higher than the fundamental periodic frequency. A frequency-domain analyzer is arranged to generate frequency band information in response to frequencies of the electrical monitor signal that are higher than the fundamental periodic frequency. A fault detector is arranged to monitor the indication of the number of high-frequency events and the generated frequency band information, and to generate a fault flag in response to the monitored indication of the number of high-frequency events and the generated frequency band information.

A compact millimeter-wave slide screw impedance tuner allows reducing to a minimum the insertion loss between the tuner and the wafer-probe. The structure of the tuner uses a 1 mm slabline and adapters, an eccentrically rotating remotely controlled wideband tuning probe and a sliding rack on which the tuning-probe is attached; the position of the rack is controlled by a permanently anchored motorized pinion. The construction method allows for maximum compactness, needed in order to be able to attach the tuner directly on the wafer-probe and minimize the insertion loss, while maintaining key advantages of electro-mechanical tuners, such as robustness, linearity, simplicity, tuning resolution and calibration and compatibility with existing load pull software and technology.