A test method for testing connectivity of a semiconductor structure includes operations as follows. A semiconductor structure and a detection transistor are provided. The semiconductor structure includes a through silicon via structure having a first terminal and a second terminal arranged to be opposite. An intrinsic conductivity factor of the detection transistor is obtained. The detection transistor is turned on upon receiving a test signal, and a test voltage is provided to the second terminal, to enable the detection transistor to operate in a deep triode region, and a current flowing through the second terminal is obtained during operation of the detection transistor in the deep triode region. A resistance of the through silicon via structure is obtained based on the intrinsic conductivity factor, an operating voltage, the test voltage, and the current flowing through the second terminal.

A test method for testing connectivity of a semiconductor structure includes operations as follows. A semiconductor structure and a detection transistor are provided. The semiconductor structure includes a through silicon via structure having a first terminal and a second terminal arranged to be opposite. An intrinsic conductivity factor of the detection transistor is obtained. The detection transistor is turned on upon receiving a test signal, and a test voltage is provided to the second terminal, to enable the detection transistor to operate in a deep triode region, and a current flowing through the second terminal is obtained during operation of the detection transistor in the deep triode region. A resistance of the through silicon via structure is obtained based on the intrinsic conductivity factor, an operating voltage, the test voltage, and the current flowing through the second terminal.

An integrated circuit includes a semiconductor die having conductive pads and an electronic component with a first terminal coupled to a third conductive pad and a second terminal coupled to a fourth conductive pad. A resistor has a first terminal coupled to the fourth conductive pad and a second terminal coupled to the fifth conductive pad, and a first transistor has a first terminal coupled to the first conductive pad, a second terminal coupled to the fifth conductive pad, and a control terminal. A second transistor has a first terminal coupled to the first transistor, a second terminal coupled to the third conductive pad, and a control terminal. A pulse generator has an input coupled to the second conductive pad and an output coupled to the control terminal of the second transistor.

A safety container for high-power, electronic device testing, the safety container including a first shell and first and second ports in the first shell. The first shell is configured to substantially surround a testing chamber sized to accommodate a device-under-test (DUT). The first shell is substantially rigid. The first port is configured to allow a fluid into the testing chamber, the second port configured to allow the fluid to exit the testing chamber.

According to one embodiment, a deterioration checking apparatus includes an inductor that is connected in series to a main current path of a MOS transistor to be checked, and forms a closed loop together with the MOS transistor when the MOS transistor is in an ON-state, a control circuit that controls ON/OFF of the MOS transistor, a current sensor that detects a current released from the inductor, and a calculation circuit that calculates an ON-resistance of the MOS transistor from an attenuation characteristic of a current released from the inductor when the MOS transistor is in an ON-state, and calculates a threshold voltage of the MOS transistor from an attenuation characteristic of a current released from the inductor when the MOS transistor is in an OFF-state. Therefore, it is possible to easily check a deterioration state of the MOS transistor.

A system to detect gate-open failures in a MOS based insulated gate transistor can include a detection circuit, including a first circuit configured to measure a drain-source voltage across the MOS based insulated gate transistor, a first comparator circuit can be configured to compare the measured drain-source voltage to a threshold drain-source conduction voltage indicating a conduction state of a channel of the MOS based insulated gate transistor, a second circuit can be configured to measure a gate voltage applied at a gate of the MOS-based insulated gate transistor, a second comparator circuit can be configured to compare the gate voltage applied at the gate to a threshold gate voltage for the MOS based insulated gate transistor to provide an indication of whether the gate voltage applied at the gate is sufficient to activate conduction in the channel and a logic circuit can be configured to detect a gate-open failure of the MOS based insulated gate transistor based on the conduction state of the channel and the indication of whether the gate voltage applied at the gate is sufficient to activate conduction in the channel when the MOS based insulated gate transistor is in an on state or an off state.

A method is provided to increase processor frequency in an integrated circuit (IC). The method includes identifying a gate included in the IC, the gate having a gate threshold voltage and performing a plasma process to form an antenna signal path in signal communication with the gate. The method further comprises adjusting the plasma process or circuit design to increase plasma induced damage (PID) applied to the gate so as to alter the gate threshold voltage.

A system to detect gate-open failures in a MOS based insulated gate transistor can include a detection circuit, including a first circuit configured to measure a drain-source voltage across the MOS based insulated gate transistor, a first comparator circuit can be configured to compare the measured drain-source voltage to a threshold drain-source conduction voltage indicating a conduction state of a channel of the MOS based insulated gate transistor, a second circuit can be configured to measure a gate voltage applied at a gate of the MOS-based insulated gate transistor, a second comparator circuit can be configured to compare the gate voltage applied at the gate to a threshold gate voltage for the MOS based insulated gate transistor to provide an indication of whether the gate voltage applied at the gate is sufficient to activate conduction in the channel and a logic circuit can be configured to detect a gate-open failure of the MOS based insulated gate transistor based on the conduction state of the channel and the indication of whether the gate voltage applied at the gate is sufficient to activate conduction in the channel when the MOS based insulated gate transistor is in an on state or an off state.

A field effect transistor (FET) engager, for example, includes electrically coupling a gate driver to a gate of a FET for testing the FET. The FET engager further includes providing a probe pad for test instrument measurement of the FET without test instrument capacitance impacting operation of the FET. The FET engager can electrically couple to the gate of the FET hold the gate of the FET at a low voltage while the source and drains are stress tested. The FET engager provides fail-safe mechanisms against accidental turn-on of the FET during operation. The FET engager can provide a second probe pad for selective test instrument turn-on of a second FET. The FET engager can allow test instrument measurement of gate current of the FET without test instrument capacitance impacting operation of the FET.

A semiconductor test apparatus according to the present disclosure includes: a stage on which a wafer is to be mounted; a pressurizing wall disposed on a surface of a probe card opposing the stage, extending toward the stage, and having an opening; a mark disposed on a lower surface of the pressurizing wall opposing the stage; a probe disposed in the opening; an air tube to force air into the opening; a detector to detect first spacing between a tip of the probe and the mark; and a controller to control second spacing between the wafer and the lower surface of the pressurizing wall based on the first spacing, wherein, when an electrical property of each of chips of the wafer is measured, the second spacing is controlled to be predetermined spacing by the controller, and the air is forced into the opening through the air tube.