The electromagnetic noise of a semiconductor device is conveniently evaluated, and the electromagnetic noise of an apparatus equipped with the semiconductor device is estimated. An evaluation method is provided which includes causing one of a first device and a second device of a semiconductor device to perform a switching operation, the semiconductor device comprising the first device and second device connected in series and a third device and a fourth device connected to each other in series and connected parallel to a series circuit of the first device and second device; measuring voltage variation occurring between the third device and the fourth device during the switching operation; and outputting an evaluation benchmark for electromagnetic noise of the semiconductor device, based on the voltage variation.

A method for screening a semiconductor device for production of excessive random telegraph sequence (RTS) noise includes measuring noise of the semiconductor device at a first temperature, changing the temperature of the semiconductor device to a second temperature different from the first temperature, measuring noise of the semiconductor device at the second temperature, extracting a characteristic of the measured noise at the first and second temperatures (e.g., standard deviation, HMM output, frequency domain spectrum of time domain noise measurement), making a comparison of the extracted first and second noise characteristics, and making a determination whether the semiconductor device produces excessive RTS noise based on whether the comparison is above a predetermined threshold. Two different bias conditions of the device may be employed rather than, or in addition to, the two different temperatures.

A system can include a plurality of device under test (DUT) cells. Each DUT cell can include a DUT and a plurality of switches configured to control a flow of current to the DUT. The system can further include a controller configured to execute a plurality of test to the plurality of DUTs in the plurality of DUT cells. Each of the plurality of tests comprises applying a measurement condition to a given DUT of the plurality of DUTs and concurrently applying a stress condition to the remaining DUTs of the plurality of DUTs, wherein the plurality of tests can provide measurements sufficient to determine a bias thermal instability and a time dependent dielectric breakdown of the given DUT.

A system comprises a noise generator circuit and a noise envelope detector circuit. The noise generator circuit comprises a first amplifier including a single transistor pair that is operable to generate 1/f noise, an output amplifier coupled to the first amplifier and configured to generate a 1/f noise signal as a function of the 1/f noise. The noise envelope detector circuit comprises a low pass filter operable to pass low frequency signals of the 1/f noise signal as a filtered 1/f noise signal, and a second amplifier or a comparator coupled to the low pass filter and operable to output a direct current (DC) voltage signal according to an envelope of the filtered 1/f noise signal, where the DC voltage signal is a function of an envelope of the filtered 1/f noise signal.

A method for testing semiconductor devices is disclosed, which includes: obtaining a result measured on a semiconductor device in one of a set of tests; comparing the result with a maximum value determined among respective results that were previously measured in one or more of the set of tests and a minimum value determined among respective results that were previously measured in one or more of the set of tests; determining, based on the comparison between the first result and the maximum and minimum values, whether to update the maximum and minimum values to calculate a delta value; comparing the delta value with a noise threshold value; determining based on the comparison between the delta value and the noise threshold value, whether to update a value of a timer; determining that the value of the timer satisfies a timer threshold; and determining that the semiconductor device incurs noise.

A method to determine noise parameters of a scalable device, is presented in which the determination of the noise parameters of the scalable device is independent of the model adopted for the device. The scalable device is connected as part of a test circuit including a noise source, a recirculator, a first power detector and a second power detector. The first power detector is connected to the recirculator and between the noise source and the scalable device and the second detector is connected to the device under test.

A method for testing semiconductor devices is disclosed, which includes: obtaining a result measured on a semiconductor device in one of a set of tests; comparing the result with a maximum value determined among respective results that were previously measured in one or more of the set of tests and a minimum value determined among respective results that were previously measured in one or more of the set of tests; determining, based on the comparison between the first result and the maximum and minimum values, whether to update the maximum and minimum values to calculate a delta value; comparing the delta value with a noise threshold value; determining based on the comparison between the delta value and the noise threshold value, whether to update a value of a timer; determining that the value of the timer satisfies a timer threshold; and determining that the semiconductor device incurs noise.

A system comprises a noise generator circuit and a noise envelope detector circuit. The noise generator circuit comprises a first amplifier including a single transistor pair that is operable to generate 1/f noise, an output amplifier coupled to the first amplifier and configured to generate a 1/f noise signal as a function of the 1/f noise. The noise envelope detector circuit comprises a low pass filter operable to pass low frequency signals of the 1/f noise signal as a filtered 1/f noise signal, and a second amplifier or a comparator coupled to the low pass filter and operable to output a direct current (DC) voltage signal according to an envelope of the filtered 1/f noise signal, where the DC voltage signal is a function of an envelope of the filtered 1/f noise signal.

A method for testing semiconductor devices is disclosed, which includes: obtaining a result measured on a semiconductor device in one of a set of tests; comparing the result with a maximum value determined among respective results that were previously measured in one or more of the set of tests and a minimum value determined among respective results that were previously measured in one or more of the set of tests; determining, based on the comparison between the first result and the maximum and minimum values, whether to update the maximum and minimum values to calculate a delta value; comparing the delta value with a noise threshold value; determining based on the comparison between the delta value and the noise threshold value, whether to update a value of a timer; determining that the value of the timer satisfies a timer threshold; and determining that the semiconductor device incurs noise.

A method for screening a semiconductor device for production of excessive random telegraph sequence (RTS) noise includes measuring noise of the semiconductor device at a first temperature, changing the temperature of the semiconductor device to a second temperature different from the first temperature, measuring noise of the semiconductor device at the second temperature, extracting a characteristic of the measured noise at the first and second temperatures (e.g., standard deviation, HMM output, frequency domain spectrum of time domain noise measurement), making a comparison of the extracted first and second noise characteristics, and making a determination whether the semiconductor device produces excessive RTS noise based on whether the comparison is above a predetermined threshold. Two different bias conditions of the device may be employed rather than, or in addition to, the two different temperatures.