Embodiments of the present disclosure provide sensors inside an In-Circuit Tester (ICT) that measure stress on a Printed Circuit Board (PCB) every time the ICT runs through a manufacturing process. This ICT can comprise an Internet of Things (IoT) device which can measure, monitor, record, and show stress data that is being exerted by ICTs on the mounted PCB in real-time during tests thereby providing technicians an ability to oversee failures based on historical data that the IoT device provides.

A test apparatus (1) for test cards (37), comprising a receiving device (3) for holding at least one test card (37) to be tested, comprising at least one contact device (4) for making electrical touch contact with electrically conductive contact points of the at least one test card (37) in the receiving device (3), wherein the contact device (4) can be arranged vertically above the receiving device for the purpose of making touch contact, and comprising an actuating device (19), which is formed to displace the contact device (4) and the receiving device (3) relative to one another for the purpose of establishing the touch contact. It is provided that the receiving device (3) can be displaced by means of the actuating device (19) from a test position, which is located vertically below the contact device (4), into a loading and unloading position, which is laterally spaced apart from the contact device (4), and the other way round.

A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A system for testing an electronic circuit board test coupon, including a test chamber. The test chamber can have at least one port through which a port extension member holding a test coupon can be inserted, minimizing air flow between the interior space of the test chamber and the surrounding area to adequately maintain elevated heat and humidity conditions within the test chamber.

An upper mechanism including a table provided with a placement surface of an inspection target, a lower mechanism configured to rotatably support the upper mechanism, and a lifting operation unit configured to be supported by the upper mechanism so as to be movable up and down are provided. The lower mechanism includes a rotation drive unit configured to rotate the upper mechanism, and a push-up force output unit configured to lift and lower the lifting operation unit. A transmission member with which a tip of the push-up force output unit can contact or separate is provided at a lower end of the lifting operation unit.

A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.

Evaluation board (EVB) assemblies or stacks utilized in tuning electronic modules are disclosed, as are methods for tuning such modules. In embodiments, the module testing assembly includes an EVB and an EVB baseplate. The EVB includes, in turn, an EVB through-port extending from a first EVB side to a second, opposing EVB side; and a module mount region on the first EVB side and extending about a periphery of the EVB through-port. The module mount region is shaped and sized to accommodate installation of a sample electronic module provided in a partially-completed, pre-encapsulated state fabricated in accordance with a separate thermal path electronic module design. A baseplate through-port combines with the EVB through-port to form a tuning access tunnel providing physical access to circuit components of the sample electronic module through the EVB baseplate from the second EVB side when the sample electronic module is installed on the module mount region.

Evaluation board (EVB) assemblies or stacks utilized in tuning electronic modules are disclosed, as are methods for tuning such modules. In embodiments, the module testing assembly includes an EVB and an EVB baseplate. The EVB includes, in turn, an EVB through-port extending from a first EVB side to a second, opposing EVB side; and a module mount region on the first EVB side and extending about a periphery of the EVB through-port. The module mount region is shaped and sized to accommodate installation of a sample electronic module provided in a partially-completed, pre-encapsulated state fabricated in accordance with a separate thermal path electronic module design. A baseplate through-port combines with the EVB through-port to form a tuning access tunnel providing physical access to circuit components of the sample electronic module through the EVB baseplate from the second EVB side when the sample electronic module is installed on the module mount region.

A probe apparatus includes a sensor including at least one element, a plurality of electrically conductive wires each of which has a connection portion at which electrical connection is made between the electrically conductive wire and the sensor so that a signal used in the sensor can flow through the electrically conductive wire, and an insulative member configured to cover at least one of the electrically conductive wires at a place nearer to a tip than the connection portion in the at least one electrically conductive wire. The insulative member having an electrical insulating property.