A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A capacitance detection area sensor includes capacitance sensor elements arranged in a two-dimensional array, is shaped into an appropriate shape, and capacitively coupled to an external electrode. To the external electrode, a sensing signal having a potential difference is supplied. The first and second sensor output signals are acquired from a capacitance sensor element capacitively coupled to the external electrode, at the timing of the sensing signal being a first signal and being a second signal, respectively. A differential signal is generated from a difference between the acquired first and second sensor output signals, and an image indicating the shape of the external electrode is generated based on the level of the differential signal, in different colors or different tones.

The present invention provides a method for detecting and adjusting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. This is accomplished, by after detecting poor back drills in a PCB, measuring the actual thickness of each PCB board. Next, the measured actual thickness of each PCB board is compared with .the theoretical thickness of each PCB board. The back drill depth for each area of the PCB board is then adjusted for its theoretical thickness and percent variation from the measured thickness.to adjust the poor back drill.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.

Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

An electronic device and a method for operating an electronic device are provided. The electronic device includes a first circuit board, a second circuit board, a signal line connecting the first circuit board and the second circuit board, a processor disposed on the first circuit board and outputting a pulse signal through the signal line, a parasitic capacitance pattern disposed around the signal line and generating a parasitic capacitance by the pulse signal, and an amplifier disposed on the second circuit board and amplifying a signal generated by the parasitic capacitance, wherein the processor identifies whether the signal line is abnormal, based on the amplified signal obtained from the amplifier.

In a general aspect, a wire bonding apparatus can include a supply of bond wire, a wire bonding head, and an electrical continuity tester. The wire bonding head can including a wire cutter. The wire cutter can be electrically conductive. The electrical continuity tester can be coupled between the supply of bond wire and the wire cutter.

A method of designing an impedance matching circuit for an input circuit is provided. The method includes receiving a user input identifying a section of the input circuit for matching an impedance to generate a characteristic impedance value; dividing the section into a first portion and a second portion; determining a first partial matching circuit of the first portion and a second partial matching circuit of the second portion using component information about electrical components connected to the section and the generated characteristic impedance value; and combining the first partial matching circuit and the second partial matching circuit to generate an ideal matching circuit.

A system detects cracks in solder joints on a printed circuit board (PCB). The system includes a device, a signal generator, a termination resistor, and a detector. The device includes a first contact and a second contact coupled to the first contact. The device is soldered to the PCB by a first solder joint at the first contact and by a second solder joint at the second contact. The signal generator has a test signal output coupled to the first solder joint. The termination resistor has a first terminal coupled to the second solder joint, and a second terminal coupled to a ground plane of the PCB. The detector receives a reflected signal that is a reflection of the test signal from at least one of the first solder joint, the second solder joint, and the termination resistor. The detector provides an indication as to whether or not at least one of the first solder joint and the second solder joint is cracked based upon a magnitude of the reflected signal.

Receive analog signal representing real-time electrical current of electrical power transmission/distribution line; sample and digitise analog signal to generate power line current data; generate data frames of subsets of the power line current data for successive overlapping time slices, process data frames to generate frequency domain data representing frequency components for different frequency ranges; process frequency domain data to generate energy data representing average energies of frequency ranges over corresponding time slice; generate two-dimensional feature for machine learning, first dimension represents plurality of the successive time slices, second dimension represents different frequency ranges, values of the two-dimensional feature represent logarithms of corresponding average energies of frequency components of electrical current over corresponding time slices; apply deep learning classifier to two-dimensional feature to detect high-impedance fault in electrical power transmission/distribution line, and if detected: send fault signal to relay or circuit breaker to cut power to the electrical power transmission/distribution line.