A measurement system for performing measurements. The measurement system includes a positioning system for positioning at least one device to be positioned. The positioning system includes at least two rotational positioner modules configured to perform a rotational movement, thereby rotating the device to be positioned, as well as at least one linear positioner module configured to perform a linear movement, thereby translationally moving the device to be positioned. The linear positioner module includes a mounting interface for the device to be positioned. The rotational positioner modules and the linear positioner module together are configured to move the device to be positioned from a starting point of the movement. The rotational positioner modules are configured to set the starting point. The linear positioner module is configured to move the mounting interface relative to the starting point.

The accuracy of an impedance tuner may be improved and the size may be reduced by using linear actuators instead of rotary motors. The linear actuator may be integrated with position sensors to allow very small size, and implemented with a servo system for best accuracy and speed. Spring loaded arms holding the mismatch probes allow the tuner to operate in any orientation to further fit into small spaces. The small size reduces losses by allowing direct connection to wafer probes for on-wafer measurement systems.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.

The disclosure relates to an RFIC apparatus, and more particularly, to an RFIC circuit having a test circuit, a test apparatus, and a test method thereof. Further, the disclosure relates to a method for estimating or determining a DC gain using a test apparatus and an RF circuit in a DC/AC test stage, and detecting defects of the RF circuit based on the estimated or determined DC gain.

A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A method for characterizing a phase shifter in a device under test (DUT) using automated test equipment (ATE) is disclosed. The method comprises down converting an input signal received from the transmitter DUT to an intermediate frequency and routing the down converted input signal to a signal processor, wherein the signal processor generates I and Q signals using the input signal. The method further comprises setting an initial phase state on the phase shifter in the transmitter DUT and toggling at least one phase state bit to control the phase shifter to cycle through a plurality of phase states, wherein the changing phase states appear on the I and Q signals. Finally, the method comprises processing the I and Q signals to extract individual phase states programmed by the at least one phase state bit.

The present disclosure relates to an electronic device (10) comprising at least one electrically conductive structure (11) with a tubular shape having outer and inner surfaces (11c, 11d) covered by an insulating layer (12), and one or more integrated circuits (13) positioned within the electrically conductive structure (11).

The present invention relates to a data acquisition of measurement data together with further data specifying the operation during a measurement. For this purpose, I/Q measurement data are obtained and the steps for operating a measurement device during the measurement are monitored. A metadata package is generated, which includes the obtained I/Q measurement data along with the monitored steps of operating the measurement device.

A method and a system for determining at least one contribution of at least one device under test (DUT) are described. The DUT may be part of a radio frequency (RF) device chain. The method includes capturing a first signal portion at a first node associated with an input of the DUT and capturing a second signal portion at a second node associated with an output of the DUT. The first signal portion and the second signal portion are captured quasi-simultaneously. The method may also include aligning the captured first signal portion and the captured second signal portion with each other temporally, and determining the contribution of the DUT by comparing the first signal portion and the second signal portion.