A testing system for testing an image sensor, includes a probe card, a pogo block receiving output signals of the probe card, an interface board configured to receive output signals of the pogo block, convert the received output signals of the pogo block, and output the converted signals through a cable, and a testing apparatus connected to the interface board through the cable. The testing apparatus is configured to test the device under test through signals received through the cable. The interface board includes an active interface module configured to amplify the received output signals of the pogo block, convert the amplified signals into signals having a same frequency as the received output signals of the pogo block, and transmit the converted signals to the cable.

A remote control device testing environment evaluates operational performance of physical implementations of remote control devices. This operational performance of the physical implementations of the remote control devices allows the integrated circuits of the remote control devices as well as integrated circuit interfaces electrically coupling these integrated circuits to each other to be evaluated. Additionally, the interconnection, such as electrical coupling to provide an example, between these integrated circuits and/or the integrated circuit interfaces can be evaluated which otherwise would not be evaluated by software simulation alone. Moreover, the evaluating of this operational performance of the physical implementations of the remote control devices allows these remote control devices to be in evaluated in a real world environment with exposure to various environmental factors, such as temperature, humidity, and/or electromagnetic interference to provide some examples. Furthermore, the evaluating of this operational performance of the physical implementations of the remote control devices allows interactions between these remote control devices and other electronic devices to be evaluated.

A method is provided in the present disclosure. The method includes several operations: generating, by a processing unit, a mapping table associated with multiple scan chains and multiple shift cycles corresponding to multiple values stored in the scan chains in an integrated circuit; determining, based on the mapping table, at least one fail flip flop in the scan chains in response to the values outputted from the scan chains; and identifying at least one fault site corresponding to the at least one fail flip flop.

A test board configured to test a device under test includes: a connection region including first and second connection terminals for contacting the device under test; and a first surface mount device located adjacent to the connection region, wherein the first connection terminal is configured to be electrically connected to a first voltage regulator of the device under test, wherein the second connection terminal is configured to be electrically connected to a second voltage regulator of the device under test, and wherein the first surface mount device is configured to be electrically connected to each of the first and second connection terminals.

The present disclosure provides functional test equipment for a device under test and method of testing the device under test. The functional test equipment includes a first power supply, a second power supply and a relay system. The first power supply is configured to generate a first supply voltage. The second power supply is configured to generate a second supply voltage different from the first supply voltage. The relay system is configured to electrically couple the first power supply or the second power supply to the device under test, wherein the first supply voltage is applied to the device under test for a first duration and the second supply voltage is applied to the device under test for a second duration less than the first duration.

An automatic robot control system and methods relating thereto are described. These systems include components such as a touch screen panel (“TSP”) robot controller for controlling a TSP robot, a camera robot controller for controlling a camera robot and an audio robot controller for controlling an audio robot. The TSP robot operates inside a TSP testing subsystem, the camera robot operates inside a camera testing subsystem, and the audio robot operates inside an audio testing subsystem. Inside the audio testing subsystem, an audio signals measurement system, using a bi-directional coupling, controls the operation of the audio robot controller. In this control scheme, a test application controller is designed to control the different types of subsystem robots. Methods relating to TSP, camera, and audio robots, and their controllers, taken individually or in combination, for automatic testing of device functionalities are also described.

A method for characterizing a phase shifter in a device under test (DUT) using automated test equipment (ATE) is disclosed. The method comprises down converting an input signal received from the transmitter DUT to an intermediate frequency and routing the down converted input signal to a signal processor, wherein the signal processor generates I and Q signals using the input signal. The method further comprises setting an initial phase state on the phase shifter in the transmitter DUT and toggling at least one phase state bit to control the phase shifter to cycle through a plurality of phase states, wherein the changing phase states appear on the I and Q signals. Finally, the method comprises processing the I and Q signals to extract individual phase states programmed by the at least one phase state bit.

The present invention relates to a data acquisition of measurement data together with further data specifying the operation during a measurement. For this purpose, I/Q measurement data are obtained and the steps for operating a measurement device during the measurement are monitored. A metadata package is generated, which includes the obtained I/Q measurement data along with the monitored steps of operating the measurement device.

A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

A method of generating a simulation model based on simulation data and measurement data of a target includes classifying weight parameters, included in a pre-learning model learned based on the simulation data, as a first weight group and a second weight group based on a degree of significance, retraining the first weight group of the pre-learning model based on the simulation data, and training the second weight group of a transfer learning model based on the measurement data, wherein the transfer learning model includes the first weight group of the pre-learning model retrained based on the simulation data.