A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a probe head of the probe within an interior cavity of the shroud, while permitting a second portion of the probe head to extend out of the shroud. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. The fluid inlet conduit enters the shroud through the access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce the heat-transfer fluid to the probe-head end of the interior cavity.

A burn-in board management system includes a production burn-in apparatus and a burn-in board status computer. The production burn-in apparatus is configured to test a plurality of integrated circuit devices mounted in slots of a burn-in board and comprising a first controller configured to generate a first burn-in board status map, wherein the first controller is further configured to suspend the burn-in board when the first burn-in board status map of the burn-in board demonstrates that more than a threshold percentage of the slots of the burn-in board are determined to be malfunctioned. The burn-in board status computer is communicably connected with the first controller of the production burn-in apparatus and configured to receive the first burn-in board status map.

A testing apparatus for testing electrical components and/or conductor track structures. The testing apparatus includes: a multiplicity of testing locations, each receiving an electrical component and/or a conductor track structure; a selection device for selecting one of the testing locations; electrical lines disposed in rows and electrical lines disposed in columns for the supply of an alternating voltage to the component or structure, situated at the selected testing location; Z diodes for the electrical connection of the respective component and/or structure at the respective testing location via one of the Z diodes to one of the rows of electrical lines; a signal generator developed to generate a test signal that has a voltage signal as the sum of a square wave signal and a wave-shaped signal; and an electromigration device for applying a direct voltage signal to the components and/or structures to bring about electromigration in the components and/or structures.

A system includes a signal generator, configured to pass a generated signal, which has two different generated frequencies, through a circuit including an intrabody electrode. The system further includes a processor, configured to identify, while the generated signal is passed through the circuit, a derived frequency, which is derived from the generated frequencies, on the circuit, and to generate, in response to identifying the derived frequency, an output indicating a flaw in the electrode. Other embodiments are also described.

Disclosed are exemplary embodiments of electrostatic discharge (ESD) pulse generators that may provide improved system level ESD robustness characterization and qualification analysis.

The present invention discloses an in-situ monitoring method and apparatus for a power electronic device explosion. A power electronic device is excited to produce an explosion failure by using a fault excitation module. An electrical signal of the power electronic device is monitored in real time by using an electrical signal monitoring module. Gas information of a test cavity is monitored in real time by using a gas monitoring module. External pictures of the power electronic device are captured by using a high-speed image capturing module. Internal pictures of the power electronic device are captured by using a high-speed X-ray imaging module. Each module in the apparatus is triggered to work according to a predetermined time sequence and time interval by using a time sequence control module. The entire apparatus is controlled and data is acquired, stored, and displayed by using a main control module.

A test card and a test display adapter are disclosed. The test card includes an assembling plate and an electrical heat source. The electrical heat source is provided on the assembling plate. The electrical heat source includes a first heat transfer plate, a second heat transfer plate and at least one heat source element. The first heat transfer plate is stacked on the assembling plate, and the second heat transfer plate is laminated over the first heat transfer plate, with the heat source element being sandwiched between the first and second heat transfer plates. The test card and the test display adapter have a wide variety of advantages including very low cost, easy material availability, a short wait time, easy manufacturability, a long service life, easy modifiability and good interoperability.

One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

A burn-in board management system includes a production burn-in apparatus and a burn-in board status computer. The production burn-in apparatus is configured to test a plurality of integrated circuit devices mounted in slots of a burn-in board and comprising a first controller configured to generate a first burn-in board status map, wherein the first controller is further configured to suspend the burn-in board when the first burn-in board status map of the burn-in board demonstrates that more than a threshold percentage of the slots of the burn-in board are determined to be malfunctioned. The burn-in board status computer is communicably connected with the first controller of the production burn-in apparatus and configured to receive the first burn-in board status map.