A testing apparatus for electromagnetically sensitive equipment includes a housing defining a testing chamber. The housing blocks transmission of electromagnetic waves from an external environment into the testing chamber and reduces reflection of electromagnetic waves within the testing chamber. The testing apparatus also includes a tube defining an air flow path between the testing chamber and the external environment. The tube blocks transmission of electromagnetic waves from the external environment into the air flow path. The tube includes a proximal end coupled to an opening in the housing such that the air flow path is fluidly coupled to the testing chamber via the opening, a distal end opposing the proximal end, and a bent segment extending between the proximal end and the distal end.

An elevator unit for transferring a tray includes a tray guide block on which a tray is seated, a wrapping connector driving member configured to elevate and lower the tray guide block, a fixed fastener connected to the tray guide block, and a corrective fastener connected to the wrapping connector driving member and configured to rotatably coupled to the fixed fastening member.

A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.

A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.

Cryogenic testing systems for testing electronic components such as wafers under cryogenic conditions are provided. The novel designs enable fast throughput by use of a cryogenically maintained test surface to which wafers may be rapidly introduced, cooled, and manipulated to contact testing elements while maintaining high quality cryogenic conditions. Thermal shielding is achieved by floating shields and/or flexible bellows that provide effective thermal shielding of the test environment while enabling manipulation of wafers with a wide range of motion. Also provided are novel door assemblies, chuck configurations, and vacuum plate bases that enable effective maintenance of cryogenic conditions and high throughput.

One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.

A system for testing a semiconductor may include a transfer chamber, at least one loadlock chamber and at least one test chamber. The transfer chamber may include a plurality of sidewalls. The loadlock chamber may be arranged on a first sidewall of the sidewalls of the transfer chamber. The loadlock chamber may include a carrier configured to receive a plurality of wafers. The test chamber may be arranged on a second sidewall of the sidewalls of the transfer chamber. When the transfer chamber is connected to the loadlock chamber, a pressure of the transfer chamber may be changed into a pressure of the loadlock chamber. When the transfer chamber is connected to the test chamber, the pressure of the transfer chamber may be changed into a pressure of the test chamber.

A burn-in chamber is provided, configured to provide the required temperature for a device under test (DUT), including a side wall, a guiding plate, an air flow plate, a partition assembly, and a fan. The air flow plate has a ventilation structure, and the guiding plate is located between the side wall and the air flow plate. The partition assembly is disposed on both sides of the air flow plate. The partition assembly and the air flow plate together form an accommodating space for accommodating the DUT. The partition assembly forms a return channel with respect to the other side of the accommodating space with the side wall. When the fan is active, air from the accommodating space passes through the air flow plate and is guided to the return channel via the guiding plate, and air is returned to the accommodating space through the return channel.

An apparatus for testing a semiconductor device is described. The apparatus includes a test chamber in which a test process for a plurality of semiconductor devices is performed, a first storage disposed in the test chamber with a first semiconductor device located therein, a second storage spaced apart in a first direction from the first storage with a second semiconductor device located therein, a first nozzle extending in the first direction on a first sides of the first and second storages and including a plurality of first air outlets configured to discharge air, a second nozzle extending in the first direction on and including a plurality of second air outlets configured to discharge air, and a controller controlling temperatures of the first and second semiconductor devices within a predefined temperature range by controlling the air discharged by the first and second nozzles.

A safety container for high-power, electronic device testing, the safety container including a first shell and first and second ports in the first shell. The first shell is configured to substantially surround a testing chamber sized to accommodate a device-under-test (DUT). The first shell is substantially rigid. The first port is configured to allow a fluid into the testing chamber, the second port configured to allow the fluid to exit the testing chamber.