A testing apparatus for electromagnetically sensitive equipment includes a housing defining a testing chamber. The housing blocks transmission of electromagnetic waves from an external environment into the testing chamber and reduces reflection of electromagnetic waves within the testing chamber. The testing apparatus also includes a tube defining an air flow path between the testing chamber and the external environment. The tube blocks transmission of electromagnetic waves from the external environment into the air flow path. The tube includes a proximal end coupled to an opening in the housing such that the air flow path is fluidly coupled to the testing chamber via the opening, a distal end opposing the proximal end, and a bent segment extending between the proximal end and the distal end.

A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: contact units that adjust a temperature of the DUT independently from one another and press the DUT against a socket independently from one another. The socket is disposed on a test head that is mounted to each of the contact units and that is connected to a tester. At least one of the contact units is removably disposed on the electronic component handling apparatus.

A substrate support includes a supporting unit and a light irradiation mechanism. The supporting unit includes a plate member on which an inspection target is placed and a transparent member. The light irradiation mechanism is configured to irradiate light to increase a temperature of the inspection target. Each of the plate member and the transparent member is made of a low thermal expansion material having a linear expansion coefficient of 1.0×10.sup.−6/K or less.

Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality zones.

Systems and methods for monitoring a number of operating conditions of a programmable device are disclosed. In some implementations, the system may include a root monitor including circuitry configured to generate a reference voltage, a plurality of sensors and satellite monitors distributed across the programmable device, and a interconnect system coupled to the root monitor and to each of the plurality of satellite monitors. Each of the satellite monitors may be in a vicinity of and coupled to a corresponding one of the plurality of sensors via a local interconnect. The interconnect system may include one or more analog channels configured to distribute the reference voltage to each of the plurality of satellite monitors, and may include one or more digital channels configured to selectively route digital data from each of the plurality of satellite monitors to the root monitor as data packets.

A tray elevator of a test handler includes a tray mounter on which a test tray is seated and having a support part and a through hole vertically penetrating the support part, a shaft vertically extending through the through hole of the tray mounter and configured to provide a path for elevating or lowering the tray mounter, a guide bushing including an outer surface and a groove at the outer surface, inserted into the through hole of the tray mounter, and configured to move along the shaft, and a ring inserted into the groove of the guide bushing.

Embodiments of the present invention provide an automated test equipment (a “tester”) for testing a device under test, including a bidirectional dedicated real-time handler interface. Some embodiments include an interface having a trigger function, a fixed endpoint interface, an interface arranged on a test head, and/or a number of lines/communication channels adapted to a specific communication task, without separate signal lines, for example. The bidirectional dedicated real-time handler interface can be used to transmit thermal control signals, and the transmitted signals can be test site specific. The real-time signaling advantageously improves testing accuracy and efficiency.

A contact resistance test method and related devices are provided. When a MOS transistor working in a linear region is tested, a functional relationship between the channel width of the MOS transistor and total resistances of the MOS transistor at sampling temperatures is determined, to determine the contact resistance of the MOS transistor at the sampling temperatures. A calibration coefficient of the contact resistance at a current ambient temperature is determined based on the contact resistance of the MOS transistor at the sampling temperatures. A measurement result of the contact resistance is further adjusted based on the calibration coefficient of the contact resistance at the current ambient temperature, to obtain an accurate contact resistance at the current ambient temperature.