A semiconductor integrated circuit (IC) comprising a signal path combiner, comprising a plurality of input paths and an output path. The IC comprises a delay circuit having an input electrically connected to the output path, the delay circuit delaying an input signal by a variable delay time to output a delayed signal path. The IC may comprise a first storage circuit electrically connected to the output path and a second storage circuit electrically connected to the delayed signal path. The IC comprises a comparison circuit that compares outputs of the signal path combiner and the delayed signal, wherein the comparison circuit comprises a comparison output provided in a comparison data signal to at least one mitigation circuit.

The present disclosure discloses a Single-Event Transient (SET) pulse measuring circuit capable of eliminating impact thereof, and an integrated circuit chip. The SET pulse measuring circuit capable of eliminating impact thereof includes four parts: a SET pulse test chain, a latch circuit, a flip-flop test circuit, a latching self-trigger circuit. The integrated circuit chip is provided with a test chain module and two sets of SET pulse measuring circuits capable of eliminating impact thereof, and inputs of the two sets of SET pulse measuring circuits capable of eliminating impact thereof are the same and each are connected to an output terminal of the test chain module.

Abstract of Disclosure A method for testing radiation susceptibility includes transmitting radiation wave to a device under test, measuring the device under test to generate a first voltage according to the radiation wave, outputting a reference voltage to a coupling device so that the coupling device generates a second voltage according to the reference voltage, adjusting the reference voltage so that the second voltage approximates the first voltage, storing the adjusted reference voltage, outputting the second voltage to the device under test according to the adjusted reference voltage to simulate an impact of the radiation wave to the device under test, the device under test accordingly transmitting a control signal to the coupling device after receiving the second voltage, and determining a status of the device under test according to the control signal.

Proposed is a wafer inspection apparatus and a wafer inspection method, which can increase inspection accuracy while reducing the amount of dry air used. The wafer inspection apparatus includes a chamber providing a space for an electrical test of a wafer, a support unit positioned inside the chamber to support the wafer, a temperature control unit for controlling a test temperature of the wafer, a dry air supply unit for supplying dry air to the chamber, and a flow control unit for controlling the dry air supply unit to adjust flow rate of the dry air based on the test temperature. The wafer inspection apparatus and the wafer inspection method of the present disclosure may increase the accuracy of the wafer inspection while preventing the drying air from being wasted by variably adjusting the flow rate of dry air supplied based on the test temperature of the wafer.

Embodiments provide a method for acoustically testing at least one MEMS device of a plurality of MEMS devices. The method comprises a step of providing at least one MEMS device. Additionally, the method comprises a step of exciting the at least one MEMS device to an acoustic vibration. Additionally, the method comprises a step of detecting the acoustic vibration of the at least one MEMS device by at least one sound sensor. Additionally, the method comprises a step of evaluating the acoustic vibration of the at least one MEMS device detected by the at least one sound sensor to test the at least one MEMS device as to an intended functionality.

A semiconductor integrated circuit (IC) comprising a time-to-digital converter (TDC) configured to measure an input-to-output delay of an I/O buffer of a pad the IC, the measured delay reflecting a connection impedance of the pad. A circuit in the IC, or a computer in communication with the IC, determines electrical connection integrity of the pad based on the measured delay of the I/O buffer.

An inspection device according to an embodiment can conduct high temperature inspection and low temperature inspection on an object to be inspected. The inspection device includes an inspection chamber in which inspection is conducted on the object; a dry air supply section that is connected to the inspection chamber via a first valve and that is configured to supply dry air into the inspection chamber; a dew point meter that is connected to the inspection chamber via a second valve and that is configured to measure a dew point in the inspection chamber; and a bypass pipe connecting the dry air supply section and the dew point meter via a third valve.

A sensor test apparatus having excellent versatility is provided. The sensor test apparatus includes a first application unit 40 including a first application device including a socket to which the sensor is electrically connected, and a pressure chamber 43 which applies pressure to the sensor, a test unit which tests the sensor 90 via the socket, a conveying robot which conveys the sensor into and out of the first application unit 40, and an apparatus main body which houses the first application unit 40, the test unit 35 and the conveying robot, and the apparatus main body has an opening which allows the first application unit 40 to be inserted into the apparatus main body and removed from the apparatus main body to an outside.

Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.

Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.