An upper mechanism including a table provided with a placement surface of an inspection target, a lower mechanism configured to rotatably support the upper mechanism, and a lifting operation unit configured to be supported by the upper mechanism so as to be movable up and down are provided. The lower mechanism includes a rotation drive unit configured to rotate the upper mechanism, and a push-up force output unit configured to lift and lower the lifting operation unit. A transmission member with which a tip of the push-up force output unit can contact or separate is provided at a lower end of the lifting operation unit.

A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

A test carrier that accommodates a DUT and includes a first flow passage through which fluid supplied from an outside of the test carrier flows.

The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.

A contact probe for electronic tests includes an upper part having an end portion for contacting a first electronic component; a lower part having an end for contacting a second electronic component; and an elongated and deformable central body interposed between the upper and lower parts. The lower part has an enlarged head with a lower surface intended to rest at least partially onto a horizontal surface, the lower surface having an inclination angle from the horizontal surface onto which it rests when the probe is unbuckled and, when the probe is buckled, it can assume a position in which the lower surface moves to rest entirely onto the horizontal surface, thereby eliminating the inclination angle.

The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

A test head assembly for a semiconductor device has a carrier, a pin seat and a test wire assembly. The carrier is formed in an L shape and has a lateral board, a perpendicular board and a opening formed through the perpendicular board. The pin seat is mounted in the corresponding opening. The test wire assembly has a test head, a plurality of connectors and a plurality of test wires. The test head is mounted on an outer sidewall of the lateral board and connected to the pin seat through the test wires and the connectors. Therefore, the pin seat is mounted on the perpendicular board of the L-shaped uprightly and the test head is mounted on the lateral board. The pin seat and the test head are not parallel to each other, and a lateral size of the test head assembly is reduced to increase the space usage.

One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

Embodiments of the present application disclose a fixing device and fixing method for chip test and a chip tester. The fixing device for chip test includes: a carrier with a fixing chamber for fixing a chip formed inside, a plurality of adjustors being disposed on sidewalls of the fixing chamber and configured to be extended or retracted to adjust a position of the chip in two orthogonal directions within a horizontal plane; and a top cover configured to cooperate with the carrier to fix the chip in a vertical direction, wherein at least one adjustable pressing cover is disposed at a bottom of the top cover, so as to autonomously adjust a pressing force applied to the chip by the pressing cover in the vertical direction. The present application is suitable for fixing chips with various overall dimensions, and can adaptively adjust a pressing force.

The present disclosure is an inspection apparatus that makes an inspection of electrical characteristics of an object to be inspected. using a contactor brought into electrical contact with an electrode of the object to be inspected, the inspection apparatus including: a position adjusting unit including the contactor, a position adjusting section that adjusts a tip position of the contactor, and a load. detecting section that detects a value of contact load between the contactor and the electrode; a position deriving section that derives an initial position of the contactor in a specific direction based on a relationship between an amount of contact displacement of the contactor in the specific direction and the value of contact load between the contactor and the electrode; and a movement performing section that moves the tip position of the contactor based on the initial position in the specific direction derived by the position deriving section.