A method for aligning a device includes: loading devices sequentially on an upper surface of a base plate having vacuum holes; suctioning the loaded device with vacuum pressure that allows minute movement of the loaded device, as the vacuum pressure is applied while the device is loaded on the base plate; moving an alignment vision assembly positioned above the base plate to the upper portion of the device to be aligned and then lowering the alignment vision assembly; checking a position of the device with a vision means through a through hole and an opening in a state, in which an alignment block surrounds the device, so as to inform a controller of the coordinates of the device; and aligning the device by finely moving the base plate in X-Y-θ directions according to the coordinates so that the device is guided to two surfaces of the opening.

Probe cards for probing highly-scaled integrated circuits are provided. A probe card includes a backplane and an array of probes extending from the backplane. Each of the probes includes a cantilever member and a probe tip. A first end of the cantilever member is coupled to the backplane, such that the cantilever member extends from the backplane. The probe tip extends from a second end of the cantilever member. The probes are fabricated from semiconductor materials. Each probe is configured to transmit electrical signals between the backplane and a device under test (DUT), via corresponding electrodes of the DUT. The probes are highly-scaled such that the feature size and pitch of the probes matches the highly-scaled feature size and pitch of the DUT's electrodes. The probes comprise atomic force microscopy (AFM) probes that are enhanced for increased electrical conductivity, elasticity, lifetime, and reliability.

An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: contact units that adjust a temperature of the DUT independently from one another and press the DUT against a socket independently from one another. The socket is disposed on a test head that is mounted to each of the contact units and that is connected to a tester. At least one of the contact units is removably disposed on the electronic component handling apparatus.

A test carrier that accommodates a DUT and includes a first flow passage through which fluid supplied from an outside of the test carrier flows.

A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

A detection device for detecting a line quality of an electric circuit includes two electrical connection members inserted into a socket and connected to two power lines, a load resistor, a switching member, a displaying module, and a control module. An end of the load resistor is connected to one of the electrical connection members, and another end thereof is connected to a first end of the switching member. A second end of the switching member is connected to the other electrical connection member. The control module controls the switching member to cut off when in a detection mode, and detects a peak voltage in a voltage waveform and records as a maximum open-circuit voltage, and controls the switching member to conduct and detects the peak voltage of the voltage waveform and records as a load voltage and calculates a load current. A line resistance value is calculated based on the maximum open-circuit voltage, the load voltage, and the load current. A message is correspondingly displayed via the displaying module.

The accuracy of an impedance tuner may be improved and the size may be reduced by using linear actuators instead of rotary motors. The linear actuator may be integrated with position sensors to allow very small size, and implemented with a servo system for best accuracy and speed. Spring loaded arms holding the mismatch probes allow the tuner to operate in any orientation to further fit into small spaces. The small size reduces losses by allowing direct connection to wafer probes for on-wafer measurement systems.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A chip detection device, a chip detection system and a control method. The chip detection device includes a support plate (100), a probe holder (110) disposed on an upper part of the support plate (100), a detection platform, and a first driving device (120) connected to the probe holder (110). The chip detection system includes a cabinet (600), which is internally provided with a chip detection device, a controller, a loading manipulator (910), an unloading manipulator (920), a chip tray bracket (700) disposed on a side of the loading manipulator (910), and a distribution tray (800) disposed on a side of the unloading manipulator (920). According to the chip detection device, the chip detection system and the control method, during the rotation of the turntable (200), the filling, detection and classification of the chips are all controlled to be automatically completed under the control of an automatic control program, which greatly improves the efficiency of the chip detection.

An apparatus for aligning a device having a fine pitch includes: a base plate, which has vacuum holes respectively formed at seating points for devices and suctions the devices with the vacuum pressure that allows minute movement as the vacuum pressure is applied in a state in which the devices are loaded; a jig plate, which is fixedly installed so as to be positioned on the upper portion of the base plate and has openings, in which the devices are received, in the same number as the number of the devices loaded on the base plate; and a base plate position adjusting means for finely moving the positions of the devices loaded on the base plate in X-Y-θ directions so as to position the devices in the openings (formed in the jig plate.