A circuit for detecting a leakage current in a semiconductor element includes a setting circuit and a detector. The semiconductor element includes a first terminal at a high-potential-side of the semiconductor element, a second terminal at a low-potential-side of the semiconductor element, and a control terminal. The control terminal receives a signal for controlling a conduction state between the first terminal and the second terminal. The setting circuit sets a duration during which a charging current flows to the control terminal as an undetectable duration, in response to turning on the semiconductor element. The detector outputs a detected signal based on a condition that the leakage current flowing from the control terminal to the second terminal, after the undetectable duration has been elapsed.

Systems, methods, and apparatuses are described for verifying the authenticity of an integrated circuit device. An integrated test apparatus may use quiescent current and/or conducted electromagnetic interference readings to determine if a device under test matches the characteristics of an authenticated device. Deviations from the characteristics of the authenticated device may be indicative of a counterfeit device.

A method performed at least partially by a processor includes performing a test sequence. In the test sequence, a test pattern is loaded into a circuit. The test pattern is configured to cause the circuit to output a predetermined test response. A test response is unloaded from the circuit after a test wait time period has passed since the loading of the test pattern into the circuit. The unloaded test response is compared with the predetermined test response.

An apparatus for testing a device under test (DUT) is provided. The apparatus includes a power supply device and a data generating device. The power supply device is configured to provide a first voltage and a second voltage to the DUT. The data generating device is configured to provide first data to the DUT. The power supply device is configured to provide the first voltage to the DUT in a first time duration. The data generating device is configured to provide the first data to the DUT in the first time duration. The power supply device is configured to provide the second voltage to the DUT in a second time duration after the first time duration. The second voltage is different from the first voltage.

A diode test module and method applicable to the diode test module are provided. A substrate having first conductivity type and an epitaxial layer having second conductivity type on the substrate are formed. A well region having first conductivity type is formed in the epitaxial layer. A first and second heavily doped region having second conductivity type are theoretically formed in the well and connected to a first and second I/O terminal, respectively. Isolation trench is formed there in between for electrical isolation. A monitor cell comprising a third and fourth heavily doped region is provided in a current conduction path between the first and second I/O terminal when inputting an operation voltage. By employing the monitor cell, the invention achieves to determine if the well region is missing by measuring whether a leakage current is generated without additional testing equipment and time for conventional capacitance measurements.

A method detects electromigration in a field replaceable unit. An integrated circuit, which is within a field replaceable unit (FRU) in an electronic device, is quiescented. An isolation power switch applies a test voltage from a field power source to a target voltage rail in the integrated circuit. An isolation power switch isolates the target voltage rail from the field power source. A voltage sensor coupled to the target voltage rail measures a field voltage decay rate for the target voltage rail. A voltage record comparator logic within the integrated circuit compares the field voltage decay rate to an initial voltage decay rate for the target voltage rail. In response to a difference between the field voltage decay rate and the initial voltage decay rate for the target voltage rail exceeding a predetermined limit, a signal is sent to an output device.

Methods and structures for leakage screening are disclosed. A method includes sorting devices manufactured from the same device design into voltage bins corresponding to a respective supply voltage. The method further includes determining a respective total power of each of the voltage bins. The method further includes determining a respective uplift power of the voltage bins. The method further includes determining a respective first leakage screen value for each of the voltage bins based on the respective uplift power of each of the voltage bins.

Methods of operating a memory device having embedded leak checks may mitigate data loss events due to access line defects, and may facilitate improved power consumption characteristics. Such methods might include applying a program pulse to a selected access line coupled to a memory cell selected for programming, verifying whether the selected memory cell has reached a desired data state, bringing the selected access line to a first voltage, applying a second voltage to an unselected access line, applying a reference current to the selected access line, and determining if a current flow between the selected access line and the unselected access line is greater than the reference current.

An apparatus includes an integrated circuit that includes an in-circuit power switch coupled to a power supply node, a functional circuit coupled between the in-circuit power switch and a ground node, a test circuit, and a test power switch coupled to the test circuit, wherein the test power switch is a replica of the in-circuit power switch. The test circuit is configured to determine characteristics of the test power switch, and to measure a voltage difference across the in-circuit power switch. The test circuit is also configured to use the characteristics of the test power switch and the voltage difference to determine a power consumption of the functional circuit.

Techniques and apparatuses are provided for detecting a short circuit between pins of an integrated circuit package. The tested pins can be adjacent or non-adjacent on the package. Various types of short circuits can be detected, including resistive, diode and capacitive short circuits. Additionally, short circuits of a single pin can be tested, including a short circuit to a power supply or to ground. The test circuit includes a current mirror, where the input path has a first path connected to a first pin and a parallel second path connected to a second pin. A comparator is connected to the output path of the current mirror. By controlling the on and off states of transistors in the first and second paths, and evaluating the voltage of the output path, the short circuits can be detected.