A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven. Then, based on determining that the measured temperatures of the temperature sensitive components exceeds the temperature limits, the computer determines an elapsed time outside of the temperature limit when the measured temperatures of the temperature sensitive components exceeds the temperature limits.

A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven. Then, based on determining that the measured temperatures of the temperature sensitive components exceeds the temperature limits, the computer determines an elapsed time outside of the temperature limit when the measured temperatures of the temperature sensitive components exceeds the temperature limits.

According to one embodiment, a method includes: supplying electrical energy to a first path by an inspection circuit with a short circuit between two first terminals through a first probe; and detecting an electrical characteristic on the first path by the inspection circuit. The two first terminals are included in a plurality of second terminals included in a flexible printed circuit board. The flexible printed circuit board includes: an electronic component including the inspection circuit and a plurality of third terminals; the plurality of second terminals; and a plurality of first wired lines connecting the plurality of second terminals and the plurality of third terminals. The first path is formed by: the two first terminals; two second wired lines connected to the two first terminals among the plurality of first wired lines; and two fourth terminals connected to the two second wired lines among the plurality of third terminals.

According to one embodiment, a method includes: supplying electrical energy to a first path by an inspection circuit with a short circuit between two first terminals through a first probe; and detecting an electrical characteristic on the first path by the inspection circuit. The two first terminals are included in a plurality of second terminals included in a flexible printed circuit board. The flexible printed circuit board includes: an electronic component including the inspection circuit and a plurality of third terminals; the plurality of second terminals; and a plurality of first wired lines connecting the plurality of second terminals and the plurality of third terminals. The first path is formed by: the two first terminals; two second wired lines connected to the two first terminals among the plurality of first wired lines; and two fourth terminals connected to the two second wired lines among the plurality of third terminals.

Provided is an immunity evaluation system that enables design feedback in consideration of a subject wiring and an improvement amount for improving an electromagnetic noise resistance of a circuit board. An immunity evaluation device includes: a storage unit configured to store characteristic data including probe-circuit board wiring coupling characteristics which are determined by a combination of a near-field probe and circuit board characteristics, and a test result; and an IC reaching signal level estimation unit configured to estimate a signal level reaching a terminal of an evaluation target IC. The immunity evaluation device receives board design information, information of the near-field probe, and test waveform instruction information of a signal applied to the near-field probe. The IC reaching signal level estimation unit reads the coupling characteristics from the storage unit based on the board design information of a test subject circuit board and the information of the near-field probe, and outputs a value of the IC reaching signal level reaching a terminal of the evaluation target IC from the board design information of the test subject circuit board, the information of the near-field probe, and the coupling characteristics.

Provided is an immunity evaluation system that enables design feedback in consideration of a subject wiring and an improvement amount for improving an electromagnetic noise resistance of a circuit board. An immunity evaluation device includes: a storage unit configured to store characteristic data including probe-circuit board wiring coupling characteristics which are determined by a combination of a near-field probe and circuit board characteristics, and a test result; and an IC reaching signal level estimation unit configured to estimate a signal level reaching a terminal of an evaluation target IC. The immunity evaluation device receives board design information, information of the near-field probe, and test waveform instruction information of a signal applied to the near-field probe. The IC reaching signal level estimation unit reads the coupling characteristics from the storage unit based on the board design information of a test subject circuit board and the information of the near-field probe, and outputs a value of the IC reaching signal level reaching a terminal of the evaluation target IC from the board design information of the test subject circuit board, the information of the near-field probe, and the coupling characteristics.

The invention relates to a system in particular a quantum sensor system, for testing a device-under-test, DUT, comprising: an optically excitable medium which is arranged to receive electromagnetic, EM, radiation emitted by the DUT, at least one light source configured to irradiate the medium with at least one light beam, wherein the medium is optically excited by the at least one light beam, a field generator unit configured to generate an electric and/or magnetic field within the medium, wherein a resonance frequency of the excited medium is modified by an amplitude of the electric and/or magnetic field, wherein an optical parameter, in particular a luminescence, of the exited medium is locally modified if a frequency of the EM radiation corresponds to the resonance frequency at a position in the medium, an image detector configured to acquire an image of the medium, wherein the image shows an intensity profile that results from the modification of the optical parameter, a processor configured to analyze the DUT based on the acquired image.

A test structure is presented for use in metrology measurements of a sample pattern. The test structure comprises a main pattern, and one or more auxiliary patterns. The main pattern is formed by a plurality of main features extending along a first longitudinal axis and being spaced from one another along a second lateral axis. The one or more auxiliary patterns are formed by a plurality of auxiliary features associated with at least some of the main features such that a dimension of the auxiliary feature is in a predetermined relation with a dimension of the respective main feature. This provides that a change in a dimension of the auxiliary feature from a nominal value affects a change in non-zero order diffraction response from the test structure in a predetermined optical measurement scheme, and this change is indicative of a deviation in one or more parameters of the main pattern from nominal value thereof.

A test structure is presented for use in metrology measurements of a sample pattern. The test structure comprises a main pattern, and one or more auxiliary patterns. The main pattern is formed by a plurality of main features extending along a first longitudinal axis and being spaced from one another along a second lateral axis. The one or more auxiliary patterns are formed by a plurality of auxiliary features associated with at least some of the main features such that a dimension of the auxiliary feature is in a predetermined relation with a dimension of the respective main feature. This provides that a change in a dimension of the auxiliary feature from a nominal value affects a change in non-zero order diffraction response from the test structure in a predetermined optical measurement scheme, and this change is indicative of a deviation in one or more parameters of the main pattern from nominal value thereof.