A load testing device includes a connection unit to which a power source being tested is connected, a hydrogen generating unit that performs electrolysis based on power supplied from the power source being tested to generate hydrogen, two or more supply units to which hydrogen obtained in the hydrogen generating unit passes and to which a portable tank is removably attached, and an operational unit that has a load amount adjustment switch and a display unit. The load amount of the hydrogen generating unit is switched depending on an operational state of the load amount adjustment switch. The display unit displays at least one of an attachment status of the portable tank and a filling status of hydrogen in the two or more supply units.

A current load circuit for testing a power supply circuit includes a control circuit and a load generation circuit. The control circuit is configured to generate a reset signal according to a clock signal. The load generation circuit is coupled to the control circuit and has several load configurations. The load generation circuit is configured to provide one of the load configurations as a current load of the load generation circuit according to the clock signal and the reset signal and receive a portion of the supply current provided by the power supply circuit according to the current load to generate an indication signal for indicating a performance of the power supply circuit.

A method for detecting perturbations in a logic circuit including a plurality of datapaths coordinated by a clock signal and at least one test circuit having a programmable length datapath for varying a test propagation delay. The test circuit further including inputs, an output and an error generator for providing an error in case that the output is different than an expected output for the inputs. The test circuit having a calibration mode including determining a critical propagation delay by varying the programmable length datapath until the error generator outputs an error, adjusting the programmable length datapath to include therein a tolerance delay, and switching into a detection mode configured to detect a perturbation in the logic circuit along the programmable length datapath in case the error generator outputs an error.

The present invention provides a glitch detector including a first inverter, a second inverter, a first capacitor and a second capacitor. The first inverter is connected between a supply voltage and a ground voltage, and is configured to receive a first signal at a first node to generate a second signal to a second node. The second inverter is connected between the supply voltage and the ground voltage, and is configured to receive the second signal at the second node to generate the first signal to the first node. A first electrode of the first capacitor is coupled to the supply voltage, and a second electrode of the first capacitor is coupled to the first node. A first electrode of the second capacitor is coupled to the ground voltage, and a second electrode of the second capacitor is coupled to the second node.

An integrated circuit is provided that comprise a receive unit to be tested for receiving an input signal and storing the input signal at a predetermined point of time. Additionally, it comprises a processor for applying an error correction to the received input signal, for comparing the error corrected signal with an expectation value and for outputting an error message when the filtered input signal does not correspond to the expectation value. A power source supplies the receive unit to be tested with an adjustable voltage and/or and adjustable current. An adjustment unit varies the predetermined point in time and the adjustable voltage respectively the adjustable current.

Power-glitch detection and power-glitch self-testing within a chip is shown. In a chip, a processor has a power terminal, a glitch detector, and a self-testing circuit. The power terminal is configured to receive power. The glitch detector is coupled to the power terminal of the processor for power-glitch detection. The self-testing circuit has a glitch generator and a glitch controller. The glitch controller controls the glitch generator to generate a self-testing glitch signal within the chip to test the glitch detector.

A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, manufacturing the integrated circuit according to the integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. The burn-in test has a minimum burn-in temperature of the integrated circuit and a burn-in heat distribution across the integrated circuit. The integrated circuit design corresponds to the integrated circuit. The integrated circuit is coupled to the test circuit board. The integrated circuit includes a set of circuit blocks and a first set of heaters.

Subject matter disclosed herein may relate to wireless energy harvesting devices and may relate more particularly to system-on-a-chip testing for wireless energy harvesting devices.

An apparatus has a semiconductor wafer hosting rows and columns of chips, where the rows and columns of chips are separated by scribe lines. Voltage regulators are positioned within the scribe lines. Each voltage regulator is connected to one or more chips. Selection circuitry is positioned within the scribe lines. The selection circuitry governs access to a chip being tested.

The present application discloses a testing system for integrated circuit device, and signal source and power supplying apparatus. The signal source provides a plurality of supply voltages and a programmable voltage to a plurality of semiconductor chip groups. The signal source includes a power supplying apparatus and a switch set. The power supplying apparatus is configured to generate an additional voltage, a plurality of base voltages, and the programmable voltage. The switch set is disposed between the power supplying apparatus and the plurality of semiconductor chip groups and converts the additional voltage and the plurality of base voltages into the plurality of supply voltages.