A circuit comprises: a bit-flipping signal generation device comprising a storage device and configured to generate a bit-flipping signal based on bit-flipping location information, the storage device configured to store the bit-flipping location information for a first number of bits, the bit-flipping location information obtained through a fault simulation process; a pseudo random test pattern generator configured to generate test patterns based on the bit-flipping signal, the pseudo random test pattern generator comprising a register configured to be a linear finite state machine, the register comprising storage elements and bit-flipping devices, each of the bit-flipping devices coupled to one of the storage elements; and scan chains configured to receive the test patterns, wherein the bit-flipping signal causes one of the bit-flipping devices to invert a bit of the register each time a second number of test patterns is being generated by the pseudo random test pattern generator during a test.

A trace subsystem of an emulation system may generate differential frame data based upon successive frames. If one compression mode, the trace subsystem may set a flag bit and store differential frame data if there is at least one non-zero bit in the differential frame data. If the differential frame data includes only zero bits, the trace subsystem may set the flag bit without storing the frame data. In another compression mode, the computer may further compress the differential data if the frame data includes one (one-hot) or two (two-hot) non-zero bits. The controller may set flag bits to indicate one of all-zeroes, one-hot, two-hot, and random data conditions (more than two non-zero bits). For one-hot or two-hot conditions, the controller may store bits indicating the positions of the non-zero bits. For random data conditions, the controller may store the entire differential frame.

A failure pattern obtaining method and apparatus are provided. The method includes that: a chip test result picture for a wafer is obtained, the chip test result picture being marked with a plurality of failure test points; a vector for every two points among all failure test points is calculated; a plurality of failure test points having a same vector are designated as a same group; a plurality of pending failure patterns are separated from each of groups; a failure pattern is obtained based on the plurality of the pending failure patterns.

A core partition circuit comprises a first decompression circuit, a second decompression circuit, a first switching circuit, an wrapper scanning circuit, a first compression circuit, a second compression circuit and a second switching circuit. The first and second decompression circuits decompress an input signal. The first switching circuit outputs the output signal of the first decompression circuit or the second decompression circuit according to a first control signal. The wrapper scanning circuit receives the output signal of the first decompression circuit or the second decompression circuit to scan the internal or the port of the core partition circuit. The first and second compression circuits respectively compress the internal logic and the port logic of the core partition circuit. The second switching circuit outputs the compressed internal logic or port logic of the core partition circuit according to the first control signal.

The present disclosure generally relates to an embedded physical layer (EPHY) for a field programmable gate array (FPGA). The EPHY for the FPGA is for a testing device that can receive and transmit in both the high speed PHYs, as well as low speed PHYs, such as MIPI PHYs (MPHYs), to meet universal flash storage (UFS) specifications. The testing device with the EPHY for the FPGA provides flexibility to support any specification updates without the need of application specific (ASIC) production cycles.

The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer’s system. Additional embodiments are also provided and described in the disclosure.

Disclosed herein is a test circuit for a 3D semiconductor device for detecting soft errors and a method for testing thereof. The test circuit includes a first Multiple Input Signature Register (MISR) disposed in a first semiconductor chip, the first MISR compressing a first test result signal corresponding to a test pattern, a second MISR disposed in a second semiconductor chip stacked on or under the first semiconductor chip, the second MISR compressing a second test result signal corresponding to the test pattern, and a first error detector to detect a soft error by comparing a first output signal output from the first MISR with a second output signal output from the second MISR.

A semiconductor device capable of suppressing a sharp change in current consumption and a self-diagnosis control method thereof are provided. According to one embodiment, the semiconductor device 1 includes a logic circuit, which is a circuit to be diagnosed, a self-diagnostic circuit for diagnosing the logic circuit, and a diagnostic control circuit for controlling the diagnosis of the logic circuit by the self-diagnostic circuit, and the diagnostic control circuit includes a diagnostic abort control circuit for gradually stopping the diagnosis of the logic circuit by the self-diagnostic circuit when the semiconductor device receives a stop signal instructing the stop of the diagnosis of the logic circuit by the self-diagnostic circuit.

A semiconductor device is provided with: a first circuit; a plurality of pattern generators connected to the first circuit and each supplying a test pattern to the first circuit; a pattern-generator control circuit controlling each of the plurality of pattern generators; a pattern compressor compressing a result output from the first circuit in response to supply of the test patterns from the plurality of pattern generators; a pattern-compressor control circuit controlling the pattern compressor; and a self-diagnosis control circuit connected to the pattern-generator control circuit and the pattern-compressor control circuit, and controlling the pattern-generator control circuit such that stop timings of the test patterns differ from one another among the plurality of pattern generators.

The invention relates to a microchip with a multiplicity of reconfigurable test structures, wherein the microchip has a test input (TDI) and a test output (TDO), wherein the multiplicity of test structures can be connected to the test input (TDI) and the test output (TDO), wherein one intermediate memory is provided for each of the multiplicity of test structures, wherein each of the multiplicity of test structures can be tested separately and concurrently with the aid of the respective intermediate memory and a corresponding individual control.