The disclosure describes a novel method and apparatus for improving the operation of a TAP architecture in a device through the use of Command signal inputs to the TAP architecture. In response to a Command signal input, the TAP architecture can perform streamlined and uninterrupted Update, Capture and Shift operation cycles to a target circuit in the device or streamlined and uninterrupted capture and shift operation cycles to a target circuit in the device. The Command signals can be input to the TAP architecture via the devices dedicated TMS or TDI inputs or via a separate CMD input to the device.

A self-test circuit for an integrated circuit, having a plurality of scan chains is provided, wherein each of the scan chains has a plurality of first memory elements, a data input for providing the scan chain with test data, wherein the data input is connected to one of the first memory elements, a plurality of second memory elements, and a switching apparatus having a first and a second switching position, which switching apparatus is coupled between the first memory elements and the second memory elements and is configured to respectively connect a last one of the first memory elements to a data output in the first switching position and to respectively connect the last one of the first memory elements to a first one of the second memory elements in the second switching position.

The present disclosure describes using the JTAG Tap's TMS and/or TCK terminals as general purpose serial Input/Output (I/O) Manchester coded communication terminals. The Tap's TMS and/or TCK terminal can be used as a serial I/O communication channel between; (1) an IC and an external controller, (2) between a first and second IC, or (3) between a first and second core circuit within an IC. The use of the TMS and/or TCK terminal as serial I/O channels, as described, does not effect the standardized operation of the JTAG Tap, since the TMS and/or TCK I/O operations occur while the Tap is placed in a non-active steady state.

The invention relates to a method, an apparatus and a non-transitory computer-readable storage medium for debugging a solid-state disk (SSD) device. The method is performed by a processing unit of a single-board personal computer (PC) when loading and executing a function of a runtime library, to include: receiving a request to drive a General-Purpose Input/Output (GPIO) interface (I/F), which includes a parameter required for completing a Joint Test Action Group (JTAG) command; issuing a first hardware instruction to the GPIO I/F to set a register corresponding to a GPIO test data input (TDI) pin according to the parameter carried in the request for emulating to issue the JTAG command to a solid-state disk (SSD) device, wherein the single-board PC is coupled to the SSD device through the GPIO I/F; issuing a second hardware instruction to the GPIO I/F to read a value of the register corresponding to the GPIO TDI pin; and replying with a completion message in response to the request.

The invention relates to an apparatus and a system for debugging a solid-state disk (SSD) device. The apparatus includes a Joint Test Action Group (JTAG) add-on board; and a Raspberry Pi. The Raspberry Pi includes a General-Purpose Input/Output (GPIO) interface (I/F), coupled to the JTAG add-on board; and a processing unit, coupled to the GPIO I/F. The processing unit is arranged operably to: simulate to issue a plurality of JTAG command through the GPIO I/F to the SSD device for dumping data generated by the SSD device during operation from the SSD device.

An Information Handling System (IHS) includes multiple hardware devices, and a baseboard Management Controller (BMC) in communication with the plurality of hardware devices. The BMC includes a first processor configured to execute a custom BMC firmware stack, and a second processor including executable instructions for receiving a request to perform a test on the first processor in which the request is received through a secure communication session established with a remote IHS. The instructions further perform the acts of controlling the first processor to perform the test according to the request, the first processor generating test results associated with the test, and transmitting the test results to the remote IHS through the secure communication session.

In various examples, a test system is provided for executing built-in-self-test (BIST) on integrated circuits deployed in the field. The integrated circuits may include a first device and a second device, the first device having direct access to external memory, which stores test data, and the second device having indirect access to the external memory by way of the first device. In addition to providing a mechanism to permit the first device and the second device to run test concurrently, the hardware and software may reduce memory requirements and runtime associated with running the test sequences, thereby making real-time BIST possible in deployment. Furthermore, some embodiments permit a single external memory image to cater to different SKU configurations.

The disclosure describes a novel method and apparatus for improving the operation of a TAP architecture in a device through the use of Command signal inputs to the TAP architecture. In response to a Command signal input, the TAP architecture can perform streamlined and uninterrupted Update, Capture and Shift operation cycles to a target circuit in the device or streamlined and uninterrupted capture and shift operation cycles to a target circuit in the device. The Command signals can be input to the TAP architecture via the devices dedicated TMS or TDI inputs or via a separate CMD input to the device.

The first logic wafer is attached to a supporting wafer, which adds sufficient depth to this bonded structure such that the first logic wafer may be thinned during the manufacturing process. The first logic wafer is thinned such that the through silicon vias may be etched in the substrate of the first logic wafer so as to provide adequate connectivity to a second logic wafer, which is bonded to the first logic wafer. The second logic wafer adds sufficient depth to this bonded structure to allow the supporting wafer to then be thinned to enable through silicon vias to be added to the supporting wafer so as to provide appropriate connectivity for the entire stacked structure. The thinned supporting wafer is retained in the finished stacked wafer structure and may comprise additional components (e.g. capacitors) supporting the operation of the processing circuitry in the logic wafers.

In various examples, a test system is provided for executing built-in-self-test (BIST) on integrated circuits deployed in the field. The integrated circuits may include a first device and a second device, the first device having direct access to external memory, which stores test data, and the second device having indirect access to the external memory by way of the first device. In addition to providing a mechanism to permit the first device and the second device to run test concurrently, the hardware and software may reduce memory requirements and runtime associated with running the test sequences, thereby making real-time BIST possible in deployment. Furthermore, some embodiments permit a single external memory image to cater to different SKU configurations.