A drive device comprises a drive unit, a source, a filter unit, and a determining unit.

A drive device for driving an actuator of an optical system comprises: a switching amplifier for generating an amplified signal depending on a modulation signal; a filter unit connected between the actuator and the switching amplifier and having at least one inductance; a providing unit for providing a supply voltage; and a two-quadrant controller having feedback capability coupled between the providing unit and the switching amplifier.

A method for operating an EUV lithography apparatus (1) with at least one vacuum housing (27) for at least one reflective optical element (12) includes operating the EUV lithography apparatus in an exposure operating mode (B), in which EUV radiation (5) is radiated into the vacuum housing, wherein a reducing plasma is generated at a surface (12a) of the reflective optical element in response to an interaction of the EUV radiation with a residual gas present in the vacuum housing. After an exposure pause, in which no EUV radiation is radiated into the vacuum housing, and before renewed operation of the EUV lithography apparatus in the exposure operating mode (B), the EUV lithography apparatus is operated in a recovery operating mode, in which oxidized contaminants at the surface of the reflective optical element are reduced in order to recover a transmission of the EUV lithography apparatus before the exposure pause.

A projection exposure apparatus for semiconductor lithography comprises an optical element and a temperature recording device for detecting a temperature on a surface of the optical element via electromagnetic radiation emanating from the surface of the optical element. The temperature recording device can comprise a filter for filtering the electromagnetic radiation.

Ultraviolet-C (UV-C) radiation shielding films including a substrate made of a fluoropolymer, a multilayer optical film disposed on a major surface of the substrate, and a heat-sealable encapsulant layer disposed on a major surface of the multilayer optical film opposite the substrate. The multilayer optical film is made of at least a multiplicity of alternating first and second optical layers collectively reflecting at an incident light angle of at least one of 0°, 30°, 45°, 60°, or 75°, at least 30 percent of incident ultraviolet light over at least a 30-nanometer wavelength reflection bandwidth in a wavelength range from at least 100 nanometers to 280 nanometers. The ultraviolet light shielding film may be applied to a major surface of a photovoltaic device, such as a component of a satellite or an unmanned aerial vehicle. Methods of making the UV-C radiation-protective films also are disclosed.

A facet assembly is a constituent part of a facet mirror for an illumination optical unit for projection lithography. The facet assembly has a facet with a reflection surface for reflecting illumination light. A facet main body of the facet assembly has at least one hollow chamber. A reflection surface chamber wall of the hollow chamber forms at least one portion of the reflection surface. An actuator control apparatus of the facet assembly is operatively connected to the hollow chamber for the controlled deformation of the reflection surface chamber wall. The result is a facet assembly that is usable flexibly as a constituent part of a facet mirror equipped therewith within an illumination optical unit for projection lithography.

An adaptive optical element for microlithography comprises at least one manipulator for changing the shape of an optical surface of the optical element. The manipulator comprises a one-piece dielectric medium which is deformable by applying an electric field, electrodes that are arranged in interconnection with the one-piece dielectric medium, and a voltage generator which is wired to the electrodes and configured to apply to the electrodes, firstly, a control voltage that serves to change a longitudinal extent of the dielectric medium and, secondly, an AC voltage that serves to heat the dielectric medium.

A catadioptric lens includes at least two optical elements arranged along an optical axis. Both optical elements are configured as a mirror having a substrate and a highly reflective coating applied to an interface of the substrate. The highly reflective coating extends from the interface of the substrate along a surface normal. At least one of the highly reflective coatings has one or a plurality of layers. The optical total layer thickness of the one layer of the plurality of layers increases radially from the inner area outward.

A metrology system includes a light beam metrology apparatus configured to sense one or more aspects of an amplified light beam and to make adjustments to the amplified light beam based on the sensed one or more aspects; a target metrology apparatus configured to measure one or more properties of a modified target after a target has interacted with the amplified light beam, and to determine a moment when the modified target achieves a reference calibration state; and a control apparatus configured to: receive the reference calibration state and the moment at which the reference calibration state is achieved from the target metrology apparatus; determine a light beam calibration state of the amplified light beam based on the received reference calibration state and the moment at which the reference calibration state is achieved; and provide the light beam calibration state to the light beam metrology apparatus.

A device (20) for detecting a temperature on a surface (15) of an optical element (14) for semiconductor lithography. The device includes an optical element (14) having a face (16) irradiated with electromagnetic radiation (7, 8, 43), a temperature recording device (21), and a temperature controlled element (22) configured to be temperature-controlled and arranged so that the predominant proportion of the intensity of the thermal radiation (25.2) detected by the temperature recording device and reflected by reflection at the surface of the optical element is emitted by the temperature-controlled element.

Also disclosed are an installation (1) for producing a surface (15) of an optical element (14) for semiconductor lithography and a method for producing a surface (15) of an optical element (14) of a projection exposure apparatus (30), wherein the surface is temperature-controlled and the surface temperature is detected during the temperature control.