An optical receptacle includes a first optical surface, a second optical surface, and an annular first cylindrical part disposed to surround a second central axis of the second optical surface. The first cylindrical part includes a first inner surface with a circular shape in a cross section perpendicular to the second central axis, and a second inner surface disposed on a second optical surface side than the first inner surface and provided with a circular shape in the cross section perpendicular to the second central axis. A diameter of the first inner surface is greater than a diameter of the second inner surface, and a length of the second inner surface in a direction along the second central axis is 0.5 to 4.0 mm.

A structure for optically aligning an optical fiber to a protonic device and method of fabrication of same. The structure optically aligns an optical fiber to the protonic device using a lens between the two which is moveable by actuator heads. The lens is moveable by respective motive sources associated with the actuator heads.

An optical receptacle includes: an optical receptacle body; two supporters which are connected to a respective end of the optical receptacle body, wherein each supporter is connected to one end of the optical receptacle body at a central portion of the respective supporter, and the two supporters face each other with a space therebetween; and four adhesive reservoirs which are disposed at respective four corners of the optical receptacle in plan view, wherein each of the adhesive reservoirs is a through hole or a recess, and the through hole or the recess is surrounded circumferentially by the supporter. The optical receptacle body and the two supporters together have a plane symmetrical shape with respect to a plane parallel to an optical axis of the light emitted from each of the second optical surfaces. The four adhesive reservoirs are disposed plane symmetrically with respect to the plane.

An optical transmission module includes a substrate having an opening portion; an optical element closing an opening on the lower surface side of the substrate and converting an electric signal into an optical signal or the optical signal into the electric signal; an optical fiber transmitting the optical signal; a ferrule closing an opening on the upper surface side of the substrate and having an optical fiber insertion hole; and a resin filled into a space surrounded at least by the substrate, the optical element, the ferrule, and a distal end of the optical fiber, wherein the ferrule has a resin filling hole spaced apart from the optical fiber insertion hole to fill the space with the resin, and an angle formed by an axis of the optical fiber insertion hole and an axis of the resin filling hole is equal to or more than 0° and less than 90°.

The present invention relates to a fiber optic sensor, a method of manufacturing the same, and a vibroscope using the same. A fiber optic sensor according to an embodiment of the present invention includes: an optical cable; an optical fiber taken out of the optical cable and provided with a fiber Bragg grating (FBG); a mold housing as a case into or to which the optical cable and the optical fiber are partially inserted and fixed, the mold housing including an optical cable accommodation groove to accommodate the optical cable, an optical fiber accommodation hole extending from the optical cable accommodation groove to accommodate the optical fiber, and a coating agent introduction hole communicated with the optical fiber accommodation hole so as to allow fluid to flow therebetween from an outer side of the mold housing so that a liquid-type coating agent permeates via the optical fiber accommodation hole; and a coating layer filling the optical fiber accommodation hole and the coating agent introduction hole and formed on an outer circumference of the optical fiber including the FBG and a surface of the mold housing.

An optical module includes a lens sheet having one or more lenses, a substrate having a photoelectric conversion device mounted on a first face thereof and having a first penetrating hole formed therethrough between the photoelectric conversion device and the one or more lenses, and an adhesive layer configured to bond a face of the lens sheet to a second face of the substrate, wherein the adhesive layer has a second penetrating hole formed therethrough between the one or more lenses and the photoelectric conversion device, and a pathway is provided to connect a space constituted by the first penetrating hole and the second penetrating hole to an outside of the space.

Systems and methods for coupling photonic integrated subcircuits are described herein. The example system can include a first cartridge (4702) including a first photonic integrated subcircuit (4706) and a first alignment feature (4720, 4722). The system can include a second cartridge (4704) including a second photonic integrated subcircuit (4708) and a second alignment feature (4724, 4726), where the first alignment feature (4720, 4722) and the second alignment feature (4724, 4726) can be configured to enable alignment between the first photonic integrated subcircuit (4706) and the second photonic integrated subcircuit (4708). When the first photonic integrated subcircuit (4706) is aligned to the second photonic integrated subcircuit (4708), a first light path of the first photonic integrated subcircuit (4706) can be optically coupled to a second light path of the second photonic integrated subcircuit (4708).

An optical module with optical fibers is intended to be able to be easily sucked and conveyed, and mounted on another substrate. An optical module of the present disclosure includes an optical device to which optical fibers are optically connected; and a carrier including a substrate and an adhesive layer formed at a surface of the substrate, and a part of the optical device and a part of the optical fibers are adhesively fixed on a surface of the adhesive layer. The optical device may include ball grid array shaped electrodes. The carrier may be provided with a plurality of holes.

A light-emitting assembly includes a substrate and a plurality of light-emitting elements. The substrate includes a component arrangement region and a planar region in a top view, and includes a base material layer, a filled layer and a protection layer in a sectional view. A thickness of the filled layer is greater than a thickness of the protection layer. The thickness of the protection layer is greater than 0 μm and less than 30 μm. The plurality of light-emitting elements are located on the component arrangement region. This disclosure can improve the non-uniform brightness issue (hotspots) or enhance the optical performance.

An optical module includes: a first board having an optical component bonded thereto with an adhesive; a connection structure part rising from the first board and made of a material having lower thermal conductivity than thermal conductivity of a material of the first board; and a second board joined to the connection structure part.