The present invention relates to a method for manufacturing a flexible photo-patterned mask. The method includes a) coating a photoresist composition on a substrate to form a photoresist film, b) exposing the photoresist film to pattern the photoresist film, c) developing the patterned photoresist film, and d) curing the developed photoresist film to form a patterned layer having a plurality of tapered openings.

The present invention employs a compound represented by the following formula (1) and/or a resin comprising the compound as a constituent: ##STR00001## wherein R.sup.1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R.sup.2 to R.sup.5 are each independently a linear, branched, or cyclic alkyl group of 1 to 10 carbon atoms, an aryl group of 6 to 10 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, an alkoxy group of 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, provided that at least one selected from R.sup.2 to R.sup.5 is a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; m.sup.2 and m.sup.3 are each independently an integer of 0 to 8; m.sup.4 and m.sup.5 are each independently an integer of 0 to 9, provided that m.sup.2, m.sup.3, m.sup.4, and m.sup.5 are not 0 at the same time; n is an integer of 1 to 4; and p.sup.2 to p.sup.5 are each independently an integer of 0 to 2.

A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO.sub.2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R.sub.1 is independently a hydrogen atom or a group represented by —CH.sub.2—O—R.sub.2. At least one of the plurality of R.sub.1s is a group represented by —CH.sub.2—O—R.sub.2. R.sub.2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. ##STR00001##

A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO.sub.2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R.sub.1 is independently a hydrogen atom or a group represented by —CH.sub.2—O—R.sub.2. At least one of the plurality of R.sub.1s is a group represented by —CH.sub.2—O—R.sub.2. R.sub.2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. ##STR00001##

A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO.sub.2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. ##STR00001##

A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO.sub.2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. ##STR00001##

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):

##STR00001##

The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.

A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as “trivalent or greater phenol compound”, and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). R.sup.a to R.sup.d and * in the formulas are as defined in the Specification. ##STR00001##

A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as “trivalent or greater phenol compound”, and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). R.sup.a to R.sup.d and * in the formulas are as defined in the Specification. ##STR00001##