A photosensitive resin composition comprising (A) a silicone resin comprising recurring units having formula (a1) and recurring units having formula (b1), (B) a filler, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which can be processed into a fine pattern in thick film form, has improved film properties like crack resistance, and is reliable as protective film. ##STR00001##

The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.

A method of matching records from a plurality of data sources having variation between them in matching quality of their data, the method including repeatedly matching and filtering records from the data sources to obtain matched records using successively less strict matching rules, the matching rules being defined based on the variation in the matching quality.

A display panel is provided. A plurality of target sub-pixels of the display panel in a pixel arrangement direction, and located in a first area and adjacent to a second area have a same luminous color. The first area and the second area correspondingly correspond to a light color area and a dark color area in an electrical testing screen. In this way, when an alignment precision inspection technique is performed based on an electrical testing screen, luminous colors of sub-pixels affecting colors of border lines are same. Therefore, the border lines having different colors caused by photoresists having different colors do not occur.

There is provided a resist underlayer film forming composition for lithography for forming a resist underlayer film capable of being used as a hardmask. A resist underlayer film forming composition for lithography comprising a hydrolyzable organosilane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof as a silane, wherein a silane having a cyclic amino group is contained in an amount of less than 1% by mole, preferably 0.01 to 0.95% by mole. A film forming composition comprising a hydrolyzable organosilane having a cyclic amino group, a hydrolysis product thereof, or a hydrolysis-condensation product thereof. A resist underlayer film forming composition for lithography comprising a hydrolyzable organosilane having a cyclic amino group, a hydrolysis product thereof, or a hydrolysis-condensation product thereof. The cyclic amino group may be a secondary amino group or a tertiary amino group. The hydrolyzable organosilane is a compound of Formula (1):
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4−(a+b)  Formula (1)
(where R.sup.1 is a cyclic amino group or an organic group containing a cyclic amino group).

A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

Provided are a hardmask composition including a structure represented by Formula 1 and a solvent, a method of forming a pattern using the hardmask composition, and a hardmask formed from the hardmask composition. ##STR00001## wherein in Formula 1, R.sub.1 to R.sub.8, X, and M are described in detail in the detailed description.

The present invention is a thermosetting silicon-containing material containing one or more of a repeating unit shown by the following general formula (Sx-1), a repeating unit shown by the following general formula (Sx-2), and a partial structure shown by the following general formula (Sx-3): ##STR00001##
where R.sup.1 represents an iodine-containing organic group; and R.sup.2 and R.sup.3 are each independently identical to R.sup.1, a hydrogen atom, or a monovalent organic group having 1 to 30 carbon atoms. This provides: a thermosetting silicon-containing material used for forming a resist underlayer film which is capable of contributing to sensitivity enhancement of an upper layer resist while keeping LWR thereof from degrading; a composition for forming a silicon-containing resist underlayer film, the composition containing the thermosetting silicon-containing material; and a patterning process using the composition.

A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.