G03F7/2016

METHOD FOR PRODUCING A FLEXOGRAPHIC PRINTING FRAME THROUGH MULTIPLE EXPOSURES USING UV LEDS
20180004093 · 2018-01-04 ·

A method for producing flexographic printing plates, using as starting material a photopolymerizable flexographic printing element which at least comprises, arranged one atop another, a dimensionally stable support, and at least one photopolymerizable, relief-forming layer, at least comprising an elastomeric binding, an ethylenically unsaturated compound, and a photoinitiator, a digitally imagable layer, and the method comprises at least the following steps (a) producing a mask by imaging the digitally imagable layer, (b) exposing the photopolymerizable, relief-forming layer through the mask with actinic light, and photopolymerizing the image regions of the layer, and (c) developing the photopolymerized layer by washing out the unphotopolymerized regions of the relief-forming layer with an organic solvent, or by thermal development, characterized in that step (b) comprises two or more exposure cycles (b 1) to (b n) with actinic light with an intensity of 100 to 5000 mW/cm.sup.2 from a plurality of UV-LEDs, the energy input into the photopolymerizable, relief-forming layer per exposure cycle being 0.1 to 5 J/cm.sup.2.

Photosensitive resin composition

A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as “trivalent or greater phenol compound”, and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). R.sup.a to R.sup.d and * in the formulas are as defined in the Specification. ##STR00001##

FLOW CELLS AND METHODS FOR MAKING THE SAME

In an example of a method for making a flow cell, a light sensitive material is deposited over a resin layer including depressions separated by interstitial regions, wherein the depressions overlie a first resin portion having a first thickness and the interstitial regions overlie a second resin portion having a second thickness that is greater than the first thickness. A predetermined ultraviolet light dosage that is based on the first and second thicknesses is directed through the resin layer, whereby the light sensitive material overlying the depressions is exposed to ultraviolet light and the second resin portion absorbs the ultraviolet light, thereby defining an altered light sensitive material at a first predetermined region over the resin layer. The altered light sensitive material is utilized to generate a functionalized layer at the first predetermined region or at a second predetermined region over the resin layer.

Metal Circuit Structure Based on FPC and Method of Making the Same
20220361336 · 2022-11-10 ·

A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

SOLVENT-FREE FLEXOGRAPHIC IMAGING AND PRINTING WITH PHOTORESPONSIVE PRINTING MEMBERS
20230037817 · 2023-02-09 ·

Flexographic printing members amenable to aqueous (or organic) development do not exhibit the deleterious effects on printing performance characteristic of some conventional alternatives. Embodiments of the invention utilize a photopolymerizable layer comprising, consisting of, or consisting essentially of a photopolymerization initiator and a water-dilutable (but not water-soluble) monomer.

PROCESS AND APPARATUS FOR AUTOMATIC MEASUREMENT OF DENSITY OF PHOTOPOLYMER PRINTING PLATES
20220349796 · 2022-11-03 · ·

A method and apparatus for measurement of density of a photosensitive printing plate (130) having a mask (132) embodying image information corresponding to an image to be printed. A density measurement system includes a first radiation source (112) spaced apart from and adjacent the plate and configured to emit radiation having a first wavelength or range of wavelengths toward the plate. A densitometer (110) spaced apart from and adjacent the plate in a fixed relationship relative to the first radiation source receives and measures an amount of the first radiation transmitted through or reflected by the plate and the mask during relative movement between the plate and the density measurement system. The densitometer readings are processed to provide an output correlating to quality of the mask. The density measurement system may be coupled to an exposure system (120,122,124) for curing the plate.

METHOD FOR EXPOSING PHOTOPOLYMERIZATION LAYER COMPRISING PHOTOPOLYMER
20230069972 · 2023-03-09 ·

A method for exposing a photopolymerization layer comprising photopolymers includes: providing a printed circuit board, with a photopolymerization layer disposed on the top side of the printed circuit board; performing first-instance exposure on the photopolymerization layer, using a UV source and a digital micro-lens device, wherein the UV source is of a power less than 0.2 kW; stopping the first-instance exposure; covering the photopolymerization layer with a mask, with the mask having a bottom side in contact with the photopolymerization layer; and performing second-instance exposure on the photopolymerization layer, using a mercury lamp and the mask, wherein the mercury lamp is of a power greater than 5 kW.

QUANTUM DOT LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
20230165025 · 2023-05-25 ·

Disclosed are a quantum dot light-emitting device and a manufacturing method thereof, including: a substrate; a first electrode, disposed on the substrate; a carrier film layer, disposed on a side of the first electrode facing away from the substrate; a fixed layer, disposed on a side of the carrier film layer facing away from the substrate, a connecting structure being arranged between the fixed layer and the carrier film layer; a quantum dot layer, disposed on a side of the fixed layer facing away from the substrate; and a second electrode, disposed on a side of the quantum dot layer facing away from the substrate.

HARDMASK COMPOSITION, HARDMASK LAYER, AND PATTERN FORMING METHOD
20220334489 · 2022-10-20 ·

The present invention relates to a hardmask composition including a compound represented by Chemical Formula 1 and a solvent, a hardmask layer including a cured product of the hardmask composition, and a pattern forming method using the hardmask composition.

##STR00001##

In Chemical Formula 1, the definitions of A, R.sup.1 to R.sup.5, and n are as described in the specification.

Custom photolithography masking via precision dispense process

Systems and methods for custom photolithography masking via a precision dispense apparatus and process are disclosed. Methods include creating a toolpath instruction for depositing opaque onto a substrate, programming a precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit opaque material onto the substrate to form the photomask. The substrate may be an optically transparent plate or film or may be an electronic substrate where the opaque material is deposited directly onto a photoresist coating. Capabilities of the systems and methods disclosed herein extend to 3D substrates and custom photolithography masking, among others.