Negatives and laminates containing negatives for exposing liquid photopolymers in UV flexographic plate making are created by printing opaque images directly onto the protective or release cover films used in plate making processes. Combining negatives and cover films in this way eliminates two layers and two interfaces in the exposure process, reducing cost and improving quality.

A mask and a method of manufacturing the same, an evaporation apparatus and a display device are provided. The method includes forming a first photoresist pattern on a substrate, the first photoresist pattern including a plurality of photoresist structures, each photoresist structure including a first surface away from the substrate and a second surface near the substrate, and the size of the first surface being smaller than that of the second surface; forming a metal layer on the substrate with the first photoresist pattern, the metal layer including a plurality of recessed regions and a plurality of raised regions; forming a second photoresist pattern in the recessed regions, an orthographic projection of the second photoresist pattern on the metal layer overlapping with the recessed regions; removing regions of the metal layer not covered by the second photoresist pattern, the second photoresist pattern, the substrate and the first photoresist pattern mask.

A liquid photosensitive ink composition capable of forming a cured product with a high refractive index and a high transparency, a cured product of the photosensitive ink composition, a display panel having a film consisting of the cured product, and a method for producing the cured product using the photosensitive ink composition. In a photosensitive ink composition including a photopolymerizable compound, and a photopolymerization initiator, a sulfide compound having specific structure and a (meth)acrylate compound having specific structure are used as the photopolymerizable compound, and a phosphine oxide compound and an oxime ester compound are used as the photopolymerization initiator.

According to one embodiment, a method for generating a droplet recipe used in imprint lithography includes acquiring feature data for a pattern shape that has been formed on a template. The feature data is acquired by measuring the pattern shape of a pattern that has been formed on the template. A dispensing amount for resin to be dispensed on a substrate for filling of the pattern of the template during imprinting of the pattern of the template on the substrate is calculated, based on the acquired feature data. A dispensing amount for resin corresponding to a target thickness of a residual film formed on the substrate during the imprinting of the pattern of the template on the substrate is also calculated. A droplet recipe for dispensing of resin during imprinting of the pattern of the template is then generated based on the calculated dispensing amounts.

A liquid ejection head includes a substrate having a liquid feeding port and an energy generating element, a substrate protective layer provided on the substrate, and a nozzle forming member provided on the substrate protective layer, and having an ejection port ejecting a liquid, and a liquid flow channel communicating with the liquid feeding port and the ejection port. The substrate protective layer comprises an ion scavenger.

Systems and methods for custom photolithography masking via a precision dispense apparatus and process are disclosed. Methods include creating a toolpath instruction for depositing opaque onto a substrate, programming a precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit opaque material onto the substrate to form the photomask. The substrate may be an optically transparent plate or film or may be an electronic substrate where the opaque material is deposited directly onto a photoresist coating. Capabilities of the systems and methods disclosed herein extend to 3D substrates and custom photolithography masking, among others.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.

A method of fabricating a thin film structure includes printing, using an electrohydrodynamic jet (e-jet) printing apparatus, a first layer comprising a first liquid ink, such that the first layer is supported by a substrate, curing the first layer; printing, using the e-jet printing apparatus, a second layer comprising a second liquid ink, such that the second layer is supported by the first layer, and curing the second layer.

Negatives and laminates containing negatives for exposing liquid photopolymers in UV flexographic plate making are created by printing opaque images directly onto the protective or release cover films used in plate making processes. Combining negatives and cover films in this way eliminates two layers and two interfaces in the exposure process, reducing cost and improving quality.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.