A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.

While a wafer stage moves linearly in a Y-axis direction, surface position information of a wafer surface at a plurality of detection points set at a predetermined interval in an X-axis direction is detected by a multipoint AF system, and by a plurality of alignment systems arranged in a line along the X-axis direction, marks at different positions on the wafer are each detected, and a part of a chipped shot of the wafer is exposed by a periphery edge exposure system. This allows throughput to be improved when compared with the case when detection operation of the marks, detection operation of the surface position information (focus information), and periphery edge exposure operation are performed independently.

A vessel (16) for an EUV radiation source, the vessel comprising a first opening (30) for accessing an interior (32) of the vessel, a first access member (34) configured to allow or prevent access to the interior of the vessel through the first opening, a second opening (36) for accessing the interior of the vessel, the second opening being arranged in the first access member and a second access member (38) arranged on the first access member and configured to allow or prevent access to the interior of the vessel through the second opening.

A method for drying a component interior of a component can be used in a lithographic process chain. The method includes a first drying step, in which simultaneously heated air is admitted into a component interior through an inlet, and the heated air is sucked out of the component interior through an outlet. The method also includes a succeeding second drying step, in which the inlet for the heated air is closed and the air is sucked out of the component interior, resulting in a reduced pressure is generated in the component interior.

A device (20) for detecting a temperature on a surface (15) of an optical element (14) for semiconductor lithography. The device includes an optical element (14) having a face (16) irradiated with electromagnetic radiation (7, 8, 43), a temperature recording device (21), and a temperature controlled element (22) configured to be temperature-controlled and arranged so that the predominant proportion of the intensity of the thermal radiation (25.2) detected by the temperature recording device and reflected by reflection at the surface of the optical element is emitted by the temperature-controlled element.

Also disclosed are an installation (1) for producing a surface (15) of an optical element (14) for semiconductor lithography and a method for producing a surface (15) of an optical element (14) of a projection exposure apparatus (30), wherein the surface is temperature-controlled and the surface temperature is detected during the temperature control.

A collector mirror for an extreme ultraviolet (EUV) light generator includes a first mirror in a vessel, the vessel being configured to receive a material and a laser beam for generating the EUV light, a second mirror surrounding the first mirror, and a detachable third mirror between the first mirror and the second mirror, the third mirror having an inner diameter that is not smaller than an outer diameter of the first mirror, and an outer diameter that is not larger than an inner diameter of the second mirror.

An inner insert for a passage opening in an outer insert for an EUV radiation source is embodied in multiple parts and/or has a plurality of sections that extend in the longitudinal direction and have different internal diameters (d.sub.i, d.sub.a).

A stage apparatus includes a surface plate as well as a guide shaft fixedly secured to the surface plate, a drive member moving along the guide shaft, and a hydrostatic fluid bearing that forms fluid films in the gap portion between the guide shaft and the drive member. The apparatus further includes: a positional deviation detection section—for detecting a relative positional deviation which occurs between the guide shaft and the drive member and which affects the thickness dimensions of the fluid films; and a state decision section for making a decision on the condition of the apparatus itself based on the positional deviation detected by the detection section and outputting information responsive to the decision.

Some implementations described herein provide techniques and apparatuses for inspecting interior surfaces of a vessel of a radiation source for an accumulation of a target material. An inspection tool, including a laser-scanning system and a motor system supported by an elongated supported member, may be inserted into the vessel to generate an accurate three-dimensional profile of the interior surfaces. Use of the inspection tool is efficient, with short setup and scan times that substantially reduce a duration associated with evaluating the interior surfaces of the vessel for the accumulation.

A sensor degradation evaluation method according to an aspect of the present disclosure includes an evaluation step of evaluating degradation of at least one of a sensor for coarse measurement that receives interference fringes produced by a spectrometer for coarse measurement and a sensor for fine measurement that receives interference fringes produced by a spectrometer for fine measurement, and the evaluation step includes causing a plurality of kinds of laser light having wavelengths different from one another to be sequentially incident on the spectrometer for coarse measurement and the spectrometer for fine measurement and acquiring a coarse-measurement wavelength and a fine-measurement wavelength on a wavelength basis from a plurality of the received interference fringes, acquiring a degradation parameter on a wavelength basis from the coarse-measurement wavelength and the fine-measurement wavelength on a wavelength basis, and comparing the degradation parameter on a wavelength basis with a threshold.